LED Module Cover Layer Layout for Precise Solder Positioning
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Solution Overview
Problem
Existing light emitting diodes (LEDs) face challenges in accurately fixing to circuit boards due to the difficulty in maintaining a short distance between the LED and the circuit board, especially when using solder, which complicates precise positioning.
Innovation Solution
A light emitting diode module design incorporating a cover layer between the LED and the conductive pattern layer, with specific overlapping and non-overlapping regions, and a solder connection through a through-hole, ensuring precise alignment and minimizing distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the distance between the light emitting diode and the circuit board is increased, then the solder amount increases making fixation easier, but the positioning accuracy deteriorates
Solution Approach 1:
The patent introduces a cover layer as an intermediary component between the light emitting diode and the circuit board. This cover layer includes a through-hole that guides the solder connection, allowing the LED to be fixed at an accurate position even with minimal solder amount. The cover layer mediates between the conflicting requirements of short distance (for accuracy) and sufficient solder volume (for easy fixation).
Solution Approach 2:
The cover layer is prepared in advance with a pre-formed through-hole at the precise position where the LED needs to be fixed. This preliminary preparation of the positioning structure eliminates the need for complex real-time alignment during the soldering process, enabling accurate fixation with reduced solder amount.
2Manufacturing precision
If the distance between the light emitting diode and the circuit board is minimized, then positioning accuracy improves, but the solder amount decreases making fixation difficult
Solution Approach 1:
The cover layer acts as a mediator that concentrates and directs the solder flow through the pre-formed through-hole. Even with a minimized distance and reduced solder amount, the through-hole ensures the solder reaches the correct position and provides sufficient bonding area, maintaining fixation reliability while achieving precise positioning.
Solution Approach 2:
The cover layer concentrates the solder connection at a specific local position (through the through-hole) rather than requiring widespread solder distribution. This localized quality enhancement ensures reliable fixation at the critical bonding point while minimizing the overall solder amount needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for accurate fixation of LEDs on circuit boards by minimizing the distance between the LED and the circuit board, enhancing stability and reducing solder spread.
Implementation Method 1
a light emitting diode configured to irradiate light
Implementation Method 2
a cover layer disposed on the conductive pattern layer and electrically insulated
Implementation Method 3
at least one of the first cover part and the second cover part includes a reflective material to reflect light emitted from the light emitting diode
Data Source
AI summary
According to an aspect of the present disclosure, there may be provided a light emitting diode module, including: a light emitting diode configured to irradiate light; a conductive pattern layer electrically connected to the light emitting diode; and a cover layer disposed on the conductive pattern layer and electrically insulated, wherein the cover layer is disposed between the light emitting diode and the conductive pattern layer to have a region that at least a portion of the cover layer overlaps with the light emitting diode when viewed from above the light emitting diode.