Conductive Adhesive Layer for LED Display Contrast
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Solution Overview
Problem
Existing LED display devices have limitations in contrast ratio and manufacturing cost, with issues related to light interference between pixels and high production costs due to complex manufacturing processes.
Innovation Solution
The use of a conductive adhesive layer with materials like In, Ag, or Sn between the substrate and light-emitting diodes, optimizing the arrangement of light-emitting diodes and conductive pads to reduce light interference and incorporating redundant bonding pad groups for flexible manufacturing, along with a conductive adhesive layer made of low-melting-point metals or alloys for reliable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional LED display devices are used, then manufacturing process is complex and cost is high, but contrast ratio is limited and light interference occurs between pixels
Solution Approach 1:
The patent introduces a conductive adhesive layer as an intermediary component between the lower substrate and the light-emitting diode. This conductive adhesive layer serves multiple functions: it provides electrical connection, mechanical bonding, and importantly, it acts as a light-blocking layer to prevent light leakage and improve contrast ratio. By using this intermediary layer, the patent simplifies the manufacturing process while achieving better display performance without requiring complex additional structures.
2Manufacturing precision
If complex manufacturing processes are used to improve display performance, then contrast ratio and light interference control improve, but manufacturing cost increases
Solution Approach 1:
The conductive adhesive layer is designed to perform multiple functions simultaneously: electrical conduction, mechanical adhesion, and optical blocking. This multi-functional approach eliminates the need for separate layers or components to address each function individually, thereby simplifying the manufacturing process and reducing costs while effectively controlling light interference between pixels and improving contrast ratio.
3Reliability
If standard bonding processes are used, then manufacturing is straightforward, but bonding reliability and flexibility are limited
Solution Approach 1:
The patent utilizes the low melting point characteristic of the conductive adhesive layer materials (such as indium, indium tin alloy, or indium silver alloy) to enable bonding at relatively low temperatures. By changing the thermal parameter of the bonding process, the patent achieves reliable bonding between the substrate and LED while maintaining flexibility in the manufacturing process and preventing damage to heat-sensitive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the contrast ratio of the display device, reduces manufacturing costs, and increases the reliability and flexibility of the production process by minimizing light interference and allowing for efficient bonding with lower processing temperatures.
Implementation Method 1
a conductive adhesive layer with materials like In, Ag, or Sn between the substrate and light-emitting diodes
Data Source
Figure 1A
Figure 1A'
Figure 1B
AI summary
A display device is provided. The display device includes a first light-emitting diode and a second light-emitting diode. The first light-emitting diode includes a first conductive pad, a second conductive pad adjacent to the first conductive pad, and a first light-emitting portion disposed on the first conductive pad. The second light-emitting diode includes a third conductive pad, a fourth conductive pad adjacent to the third conductive pad, and a second light-emitting portion disposed on the third conductive pad. A distance between the first conductive pad and the third conductive pad is less than a distance between the second conductive pad and the fourth conductive pad.