LED Display Bonding Member Height Compensation
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Solution Overview
Problem
The existing LED display apparatuses face issues with image distortion due to height differences between LED modules, leading to color distortions and reduced image quality, and require lengthy manufacturing times to adjust these differences.
Innovation Solution
A display apparatus with a bonding member, such as UV curable resin, is used to bond printed circuit boards to frames, ensuring uniform height and stability, thereby preventing color distortions and reducing manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple LED modules are combined to form a display apparatus, then the display size can be expanded and space usability is improved, but height differences between modules occur during manufacturing causing image distortion
Solution Approach 1:
The patent introduces a bonding member as an intermediary element between the LED module and the frame. This bonding member includes a compensating portion that can be adjusted in height to compensate for variations in LED module heights, thereby maintaining overall height uniformity across the display apparatus while allowing individual modules to have manufacturing tolerances
Solution Approach 2:
The patent changes the physical parameters of the bonding structure by providing a bonding member with adjustable height compensation. The compensating portion can be adjusted to different height levels to match variations in LED module heights, transforming the rigid height requirement into a flexible parameter that can be adapted to manufacturing variations
2Manufacturing precision
If height differences between LED modules are adjusted manually, then image quality can be improved, but manufacturing time increases and productivity decreases
Solution Approach 1:
The patent incorporates height compensation features into the bonding member design before assembly. The compensating portion is pre-configured with adjustable height levels, allowing workers to simply select and install the appropriate height variant rather than performing time-consuming manual adjustments during the assembly process
Solution Approach 2:
The patent uses a simple, easily replaceable bonding member with pre-set height compensation rather than complex adjustable mechanisms. These bonding members can be quickly exchanged if needed, and their simple structure allows for rapid installation without requiring skilled adjustment work, thereby maintaining high productivity
3Manufacturing precision
If bonding members are used to bond printed circuit boards to frames, then height uniformity and image quality are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the bonding function into a separate bonding member component that can be independently manufactured and then assembled. This segmentation allows the height compensation feature to be built into the bonding member itself during its manufacturing process, rather than requiring complex adjustment mechanisms during final assembly, thus reducing overall system complexity while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves image quality by eliminating height differences between LED modules, preventing color distortions, and streamlining the manufacturing process, resulting in increased productivity and reliability.
Implementation Method 1
The bonding member may include a ultra violet (UV) curable resin, and the bonding member in a liquid state may be injected between the printed circuit board and the frame through the frame hole and the chassis hole
Data Source
AI summary
A display apparatus and a manufacturing method thereof are provided. The display apparatus includes a printed circuit board on which a plurality of light emitting diodes (LEDs) is mounted; a frame configured to support the printed circuit board, and including a frame hole passing through the frame; a chassis coupled to the frame, and including a chassis hole configured to correspond to the frame hole; and a bonding member positioned between the printed circuit board and the frame, through the frame hole and the chassis hole, the bonding member configured to bond the frame to the printed circuit board.