Three-Color LED Display Stack With Integrated Control Circuit
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Solution Overview
Problem
The challenge in display devices is to maintain both high resolution and brightness while minimizing the control circuit area, as separate manufacturing and stacking of light-emitting and control circuit areas can lead to issues with bonding strength, yield, and process accuracy.
Innovation Solution
A display element with a three-colored LED light emitting structure and a control circuit integrated on the same substrate, where each layer is stacked in order, and conductive vias and active device layers are formed to connect the semiconductor layers, allowing direct placement of the control circuit on the light emitting structure, thereby reducing the effective light-emitting area and improving resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the control circuit area is disposed beside the light-emitting area, then the control circuit can be separately manufactured, but the effective light-emitting area decreases
Solution Approach 1:
The patent merges the control circuit area with the light-emitting area by stacking the control circuit directly on top of the light-emitting structure. This vertical integration allows both functions to occupy the same footprint area, thereby maximizing the effective light-emitting area while maintaining separate manufacturing capabilities through selective formation of active devices in different regions.
2Area of stationary object
If the control circuit is stacked on the light-emitting structure, then the effective light-emitting area is improved, but bonding strength and yield become concerns
Solution Approach 1:
The patent performs preliminary actions by forming the light-emitting structure and control circuit components on the same substrate before any bonding or stacking operations. The active devices are formed with their conductive connections established in advance, and the structure is designed to allow direct stacking without requiring additional bonding processes, thereby eliminating bonding strength and yield issues.
3Ease of manufacture
If separate manufacturing and stacking is used, then manufacturing flexibility is improved, but transferring and bonding accuracy becomes problematic
Solution Approach 1:
The patent merges both manufacturing processes into a single integrated fabrication sequence on one substrate. The control circuit active devices and light-emitting structure are formed simultaneously through coordinated patterning and deposition steps, eliminating the need for separate transferring and bonding operations that would require high precision alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach avoids the issues of transferring and bonding accuracy, enhances the bonding strength between components, and reduces the overall area of the display element, leading to improved resolution and effective light-emitting area without the drawbacks of traditional methods.
Implementation Method 1
The gate electrode electrically connects to one of the electrodes and achieves a purpose of current control through an electric field induction to a carrier in the semiconductor active layer
Implementation Method 2
A light-emitting element can be divided into two areas, a control circuit area and a light-emitting area
Data Source
AI summary
A display element includes a substrate, a three-colored LED light emitting structure, a first insulation layer, a first active device layer, at least one conductive via and at least one electrode. The three-colored LED light emitting structure is located on the substrate. The first insulation layer is located on the fourth semiconductor layer. The first active device layer is located on the first insulation layer, and the first active device layer includes at least one transistor. The conductive via extends from the first active device layer to and electrically connects at least one of the first semiconductor layer, the second semiconductor layer, the third semiconductor layer and the fourth semiconductor layer. The electrode is located upon the first active device layer.