Semiconductor LED Display Stacking for Fine-Pitch Mass Production
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Solution Overview
Problem
The challenge lies in manufacturing large-area displays using semiconductor light emitting devices, where the high process difficulty and time required for wiring and aligning millions of devices lead to reduced mass production yield and efficiency.
Innovation Solution
A display device structure and manufacturing method involving a temporary substrate where semiconductor light emitting devices are transferred and a wiring substrate is stacked directly on the temporary substrate, allowing for electrical connection through a stacking process, eliminating the need for separate wiring and alignment steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor light emitting devices are transferred to a substrate and wired individually, then electrical connection is achieved, but mass production yield and efficiency are reduced due to high process difficulty and time
Solution Approach 1:
The patent merges the transfer process and wiring process into a single integrated operation. Seed electrodes are pre-formed on the temporary substrate before device transfer, allowing both alignment and electrical connection to occur simultaneously during the transfer process, eliminating separate wiring steps and significantly improving mass production efficiency
Solution Approach 2:
The patent performs preliminary formation of seed electrodes on the temporary substrate before transferring the semiconductor light emitting devices. This preliminary action enables the wiring structure to be ready in advance, so that when devices are transferred, electrical connections are established automatically through the pre-positioned seed electrodes, reducing process complexity and time
2Manufacturing precision
If semiconductor light emitting devices are arranged at minute intervals for high-resolution display, then image quality is improved, but mass production yield is rapidly reduced during align and wiring processes
Solution Approach 1:
The patent introduces a temporary substrate as an intermediary platform that pre-hosts the seed electrodes in precise positions corresponding to the final display arrangement. This intermediary structure allows devices to be transferred directly to their final positions with accurate alignment, as the seed electrodes serve as both positioning markers and electrical connection points, eliminating the need for complex post-transfer alignment processes
Solution Approach 2:
The patent segments the manufacturing process into distinct stages: (1) forming seed electrodes on temporary substrate, (2) transferring devices to temporary substrate, and (3) completing the display structure. This segmentation allows each stage to be optimized independently, with the temporary substrate serving as a dedicated platform for precise device placement before final integration
Data Source
AI summary
The present invention provides a display device using a semiconductor light-emitting element and a manufacturing method therefor, the display device transferring semiconductor light-emitting elements on a temporary substrate, and then directly implementing, through a stack process, the structure of a wiring substrate on the temporary substrate on which the semiconductor light-emitting elements are arrayed, thereby enabling the semiconductor light-emitting elements and the wiring substrate to be electrically connected.