LED Display Manufacturing Using Temporary Substrate Transfer
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Solution Overview
Problem
Existing flat-panel displays, such as LCDs and OLEDs, face challenges in reducing thickness and weight due to the need for backlight modules in LCDs and high costs and short lifespan of OLEDs, which hinder their widespread adoption.
Innovation Solution
A manufacturing method for LED displays using a temporary substrate with adhesive layers and wavelength transition layers to mount LED chips on transparent substrates, allowing for lightweight, efficient, and cost-effective production with multi-wavelength emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If LCD is used, then the display technology is mature and cost is low, but the thickness and weight cannot be further reduced due to the backlight module
Solution Approach 1:
The patent removes the backlight module from the display structure, extracting the light source function and replacing it with self-luminous LED chips. This eliminates the need for complex backlight components while achieving thinner and lighter displays.
Solution Approach 2:
The patent replaces the mechanical backlight module system with a semiconductor-based LED light source system. This substitution transitions from a bulky mechanical structure to a compact electronic component, significantly reducing weight and thickness.
2Length of moving object
If OLED is used, then the display is self-luminous and does not require backlight module, but the light emitting material is expensive, lifespan is short, and manufacturing process is complicated
Solution Approach 1:
The patent divides the display into separate pixel units with individual LED chips, allowing for modular manufacturing. This segmentation enables simpler production processes compared to OLED while maintaining thin-form-factor benefits.
Solution Approach 2:
The patent changes the material parameter from organic compounds (OLED) to inorganic semiconductor materials (LED), which improves lifespan and manufacturing ease while maintaining the self-luminous property and thin profile.
3Ease of manufacture
If LED chips are mounted directly without temporary substrate, then the manufacturing process should be simpler, but the alignment and bonding precision is difficult to achieve
Solution Approach 1:
The patent performs preliminary mounting of LED chips on a temporary substrate before final transfer to the display substrate. This preliminary action allows for precise alignment and bonding to be achieved in a controlled manner, ensuring manufacturing precision while maintaining process simplicity.
Solution Approach 2:
The patent introduces a temporary substrate as an intermediary carrier between the LED chip manufacturing process and the final display assembly. This intermediary enables precise positioning and bonding without complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in LED displays that are lighter, more efficient, have higher contrast, and longer lifespan, overcoming the limitations of traditional displays by eliminating the need for backlight modules and reducing manufacturing complexity.
Implementation Method 1
the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer
Implementation Method 2
The second transparent substrate is bonded to the first, second and third LED chips by the packaging material
Implementation Method 3
each of the first, second and third sub-pixels are respectively surrounding by a light-insulating structure
Data Source
AI summary
A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.