LED Display Assembly With Adhesive Transfer Bonding
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Solution Overview
Problem
The existing methods for manufacturing display devices using semiconductor light-emitting devices face challenges in reducing the number of transfers required for electrical connection, leading to decreased production yield and increased costs due to the complexity and potential damage during the transfer process.
Innovation Solution
A display device and manufacturing method that utilize adhesive patterns with both adhesive and transfer properties, formed from a non-conductive paste, to directly connect light-emitting devices to wiring electrodes on a substrate, reducing the number of transfer steps and eliminating the need for temporary substrates, thereby enhancing yield and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple transfer steps are used to electrically couple semiconductor light emitting devices with wiring electrodes, then electrical connection can be achieved, but production yield decreases and production cost increases
Solution Approach 1:
The patent combines the transfer function and adhesive function into a single adhesive pattern layer. This adhesive pattern simultaneously serves as the transfer medium to move light emitting devices from the growth substrate to the wiring substrate and as the bonding agent to electrically couple the devices with the wiring electrodes, eliminating the need for separate transfer and adhesive layers and reducing the number of transfer steps
Solution Approach 2:
The adhesive pattern is designed to perform multiple functions: it acts as a transfer medium during the picking-up process, provides adhesive bonding between the light emitting device and wiring electrode, and establishes electrical connection. This multi-functional design reduces process complexity and improves production yield by minimizing handling steps
2Reliability
If multiple transfer steps are used to electrically couple semiconductor light emitting devices with wiring electrodes, then electrical connection can be achieved, but production cost increases
Solution Approach 1:
The patent merges the transfer process and bonding process into a single integrated step. The adhesive pattern enables both the transfer of light emitting devices from the growth substrate and their electrical coupling with wiring electrodes in one operation, reducing the number of process steps and associated costs
Solution Approach 2:
The patent extracts the transfer function from the adhesive function by designing the adhesive pattern with specific transfer properties. The adhesive pattern can be selectively removed from the growth substrate while retaining the light emitting device, enabling direct transfer to the wiring substrate without requiring separate transfer tapes or intermediate substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and improves productivity by minimizing positional movement and damage to light-emitting devices during transfer, while ensuring consistent bonding and gap filling across large areas.
Implementation Method 1
adhesive patterns having adhesive property for bonding the wiring electrodes and the light emitting devices
Implementation Method 2
The NCP may have a viscosity of 10,000 to 100,000 centipoise (cps)
Data Source
AI summary
Disclosed are a display device using a semiconductor light emitting element, and a method for manufacturing same. In order to achieve the above objective, the display device according to an embodiment of the present disclosure may comprise: a wiring substrate; wiring electrodes at least partially placed on the wiring substrate; light emitting elements each electrically connected to a wiring electrode corresponding thereto, among the wiring electrodes; adhesive patterns having an adhesive property for bonding the wiring electrodes and the light emitting elements and a transfer property required for transferring the light emitting elements to the wiring electrodes, wherein each of the adhesive patterns may be formed for at least one combined pair formed by a wiring electrode and a light emitting element electrically connected to each other, among the wiring electrodes and the light emitting elements, and the adhesive patterns are formed to be spaced apart from each other.