LED Display Modules Transfer Printing Grid Barriers
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Solution Overview
Problem
Existing LED display modules face challenges in achieving high-quality resolution due to large distances between LEDs, leading to poor color reproducibility and light interference, particularly when mounting red, green, and blue LEDs on a micrometer-sized substrate, where accurate height and interval placement are difficult, and wire bonding is time-consuming.
Innovation Solution
The method involves transfer printing of LED chips in a matrix onto an active matrix substrate, using primary and secondary transfer printing to arrange solder bumps and LED chips precisely, followed by forming grid barriers and aligning color cells to isolate and match LED chips, ensuring uniform height and precise electrical connection, thereby reducing pixel size and minimizing light interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If LED chips are mounted manually with wire bonding, then electrical connection can be achieved, but manufacturing time increases to tens to hundreds of hours per product
Solution Approach 1:
The patent replaces the mechanical wire bonding process with a direct electrical connection method using conductive adhesive paste. LED chips are mounted directly onto the substrate with the conductive paste providing both mechanical attachment and electrical connection, eliminating the need for separate wire bonding steps and dramatically reducing manufacturing time
Solution Approach 2:
The patent merges the mounting process and electrical connection process into a single step. The conductive adhesive paste simultaneously provides mechanical bonding and electrical connectivity, combining functions that were previously performed by separate mounting and wire bonding operations
2Ease of manufacture
If LED chips are mounted at different heights and intervals, then mounting flexibility increases, but color reproducibility deteriorates
Solution Approach 1:
The patent changes the mounting parameters by using a standardized mounting process with conductive adhesive paste that ensures uniform height and precise interval placement of LED chips. This standardized approach with controlled parameters achieves both ease of manufacture and high color reproducibility
3Manufacturing precision
If distance between pixels is reduced, then display resolution improves, but light interference between sub-pixels increases
Solution Approach 1:
The patent extracts and removes the light interference problem by introducing black matrix structures and isolation barriers between adjacent sub-pixels. These structures physically block light from neighboring pixels, allowing high pixel density without suffering from light interference
Solution Approach 2:
The patent introduces intermediary structures (black matrix, isolation barriers) between adjacent LED chips that act as light-blocking mediators. These intermediaries prevent direct light interaction between closely spaced pixels, enabling high resolution displays without light interference
Data Source
AI summary
An LED display module is disclosed. The LED display module includes: an active matrix substrate including a plurality of control units; a plurality of pairs of solder bumps arranged in a matrix on the active matrix substrate by transfer printing; a plurality of LED chips including pairs of electrodes connected to the corresponding plurality of pairs of solder bumps and arranged in a matrix on the active matrix substrate by transfer printing; grid barriers formed on the active matrix substrate to isolate the plurality of LED chips into individual chip units; and a multi-color cell layer including a plurality of color cells and aligned with the active matrix substrate such that the plurality of color cells match the plurality of LED chips in a one-to-one relationship. The plurality of color cells include first color cells, second color cells, and third color cells disposed consecutively in one direction.