Semiconductor LED Display Wiring Layout for Precise Self-Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The technical challenge lies in precisely controlling the spacing between assembly wirings in display devices using semiconductor light emitting devices, while also preventing corrosion and ensuring accurate electrical connections.
Innovation Solution
The proposed solution involves a display device configuration that includes a substrate with spaced apart first and second assembly wirings, each comprising a conductive layer and a clad layer. A structure with a reverse taper shape is in contact with the second assembly wiring, and a planarization layer with openings is used to house the light emitting device, ensuring precise wiring spacing and minimizing the pocket size for assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer light emitting devices in fluid, then large-screen display devices can be implemented, but assembly wiring is corroded by fluid causing electrical short-circuits and assembly defects
Solution Approach 1:
A clad layer is introduced as an intermediary protective structure between the conductive assembly wiring and the corrosive fluid environment. This clad layer acts as a barrier that prevents direct contact between the fluid and the conductive wiring, thereby eliminating corrosion while maintaining the self-assembly transfer process in fluid.
2Productivity
If light emitting device is transferred to substrate, then display device can be assembled, but light emitting device may be assembled at incorrect angle causing electrical connection problems
Solution Approach 1:
A structure with a specific shape is formed on the substrate before the light emitting device transfer process. This pre-formed structure serves as a mechanical guide that automatically orientates the light emitting device at the correct angle during self-assembly, ensuring proper electrical connection without requiring post-assembly adjustment.
3Ease of manufacture
If exposure device is used for patterning assembly wiring, then wiring can be formed, but performance limitations prevent precise control of wiring spacing and increase opening size
Solution Approach 1:
The patent changes the fabrication approach from exposure-based patterning to direct formation of assembly wirings with controlled spacing. By adjusting the spacing parameter between assembly wirings and optimizing their geometric configuration, precise positioning is achieved while maintaining ease of manufacture through simplified fabrication processes.
Data Source
AI summary
A display device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring that are spaced apart from each other on the substrate and each include a conductive layer and a clad layer on the conductive layer, a structure that is in contact with the second assembly wiring and has a reverse taper shape, a planarization layer that is disposed on the first assembly wiring and the second assembly wiring and has an opening, and a light emitting device that is disposed inside the opening and has a first electrode overlapping the first assembly wiring and the second assembly wiring, wherein the structure is disposed to cover a portion of an upper surface of the conductive layer of the second assembly wiring.