LED Driver Package Layout for Smaller Display Pixels
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Solution Overview
Problem
Current semiconductor light-emitting device packages face challenges in reducing size due to the structural arrangement of IC chips, electrodes, and printed circuit boards, making it difficult to miniaturize beyond a certain limit while maintaining efficient driving and manufacturing cost-effectiveness.
Innovation Solution
The integration of a light-emitting device and driver within a package, where the driver includes a first and second pad on one surface, with the light-emitting device mounted on the second pad, and a bonding portion connected to the first pad, allowing for a reduced cross-sectional area and simplified structure, enabling smaller curvature and transparent displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the LED and driver are mounted separately on a PCB board, then the driving function is reliable, but the package size cannot be reduced below a certain level
Solution Approach 1:
The patent merges the driver and light-emitting device into a single integrated package structure. The driver is mounted on a substrate with bonding pads that directly connect to the LED, eliminating the need for separate PCB mounting and reducing the overall package footprint while maintaining reliable electrical connections through integrated bonding structures.
2Area of stationary object
If the package size is reduced to minimize bezel size, then the display device becomes more compact, but the structural arrangement of IC chip, electrodes, and PCB board becomes difficult to maintain
Solution Approach 1:
The integrated package is segmented into functional regions on the substrate: a driver mounting region with bonding pads for the driver IC, and a LED mounting region with corresponding bonding pads. This segmentation allows compact arrangement while maintaining clear functional separation and simplified wiring patterns, reducing structural complexity compared to separate mounting approaches.
3Ease of manufacture
If a traditional separate mounting structure is used, then manufacturing is straightforward, but the package structure remains large and complex
Solution Approach 1:
The patent transitions from a planar separate-mounting arrangement to a vertically integrated three-dimensional structure. The driver and LED are stacked vertically on the substrate with bonding pads arranged in corresponding vertical alignment, enabling compact package area while maintaining manufacturing simplicity through standardized bonding processes in the vertical dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the size of the light-emitting device package, facilitates easier repair, and lowers manufacturing costs by simplifying the package structure, while maintaining efficient light emission and control.
Implementation Method 1
a light emitting diode (LED)... which is a well-known semiconductor light-emitting element that converts electric current into light
Data Source
AI summary
A light-emitting device package may comprise: a drive part which has a first pad and a second pad disposed at one surface thereof, the second pad being electrically connected to a light-emitting device, and controls driving of the light-emitting device; the light-emitting device disposed on the second pad; and a bonding part, wherein the light-emitting device and the bonding part may be disposed together on one surface of the drive part.