LED Device Dual Molding Reflective TiO2 SiO2 Light Extraction
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Solution Overview
Problem
Conventional light emitting diode (LED) devices face challenges in achieving high light extraction efficiency due to limited reflection and distribution of light emitted laterally, leading to reduced luminous flux and illumination.
Innovation Solution
The implementation of a light emitting diode device with a reflective first molding member made of silicon with added TiO2, which surrounds the LED chip to reflect laterally emitted light, combined with a second molding member with a different refractive index and added SiO2, to enhance light extraction efficiency and uniform distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional LED device is used without specialized molding members, then the device structure is simple, but the light extraction efficiency is low and luminous flux is reduced
Solution Approach 1:
The molding member is divided into two distinct segments: a first molding member with reflective properties (TiO2 added silicon) and a second molding member with different refractive index (SiO2 added silicon). This segmentation allows each part to perform its specific function optimally - the first member reflects laterally emitted light while the second member enhances light extraction through refractive index differences, thereby resolving the contradiction between structural simplicity and light extraction efficiency.
Solution Approach 2:
The patent employs composite materials by adding TiO2 to silicon for the first molding member and SiO2 to silicon for the second molding member. These composite materials provide both the mechanical structural support and the specific optical properties (reflectivity and refractive index) needed to improve light extraction efficiency while maintaining manufacturability through established semiconductor packaging processes.
2Productivity
If a reflective first molding member with TiO2 is added to surround the LED chip, then light extraction efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the molding member structure. The first molding member combines structural support, lateral light reflection (through TiO2 addition), and moisture barrier functions. The second molding member combines structural support and light extraction enhancement (through SiO2 addition). This merging approach improves light extraction efficiency while avoiding the need for separate, additional components that would increase device complexity.
Solution Approach 2:
The molding members are designed to perform multiple functions simultaneously: mechanical support, optical management (reflection and extraction), and environmental protection (moisture resistance). This multi-functionality reduces the need for separate dedicated components, thereby improving light extraction efficiency without proportionally increasing device complexity.
3Illumination intensity
If TiO2 is added to silicon for the first molding member, then light reflection is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent changes the material parameters by adding specific amounts of TiO2 to silicon to achieve the desired reflective properties. This parameter change approach allows for controlling the reflection capability through material composition rather than complex structural design, making the manufacturing process more straightforward despite the enhanced optical performance.
4Productivity
If SiO2 is added to silicon for the second molding member, then light extraction efficiency is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent changes the refractive index parameter of the second molding member by adding SiO2 to silicon. This material parameter change enables improved light extraction efficiency through refractive index differences at interfaces, while the manufacturing process remains relatively simple as it involves standard semiconductor material processing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves luminous flux and illumination by effectively reflecting and distributing light, while also enhancing adhesive strength and moisture penetration resistance.
Implementation Method 1
a reflective first molding member made of silicon with added TiO2, which surrounds the LED chip to reflect laterally emitted light
Implementation Method 2
enhancing adhesive strength
Implementation Method 3
moisture penetration resistance
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Disclosed are a light emitting device. The light emitting device includes a body having a cavity; a plurality of lead frames in the cavity; a light emitting chip; a first molding member having a first metal oxide material around the light emitting chip; and a second molding member having a second metal oxide material on the first molding member and the light emitting chip, wherein the light emitting chip includes a reflective electrode layer under a light emitting structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting chip and a lateral side of the reflective electrode layer at a predetermined curvature, and wherein a bottom surface of the second molding member includes a curved surface which is convex toward the first molding member.