LED Electrode Structure for Small-Chip Transfer and Mounting
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Solution Overview
Problem
Light emitting diodes (LEDs) with small luminous areas face issues of low current density, difficulty in mounting, and low manufacturing yield due to their small size, which complicates replacement and transfer processes.
Innovation Solution
The use of substrate electrodes with protruding portions and electrode-enlarging structures to support LED chips, allowing for high current density and improved manufacturing yield by facilitating the transfer and connection of LED chips with insulating materials and connection electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the luminous area of LED is reduced to increase current density, then luminous efficacy is improved, but mounting and replacement difficulty increases
Solution Approach 1:
The patent introduces a protruding portion on the substrate electrode that extends upward to contact the LED chip. This vertical dimension addition allows the mounting structure to engage with the small-sized LED chip from above, making mounting and replacement operations easier without increasing the horizontal footprint or luminous area of the LED itself.
Solution Approach 2:
The protruding portion of the substrate electrode acts as an intermediary element between the substrate and the LED chip. It provides a mechanical interface that facilitates the mounting and replacement of small LED chips, solving the handling difficulty caused by reduced LED size while maintaining the small luminous area needed for high current density.
2Loss of energy
If the luminous area of LED is reduced to increase current density, then luminous efficacy is improved, but manufacturing yield decreases
Solution Approach 1:
By adding the vertical protruding portion to the substrate electrode, the patent creates a more robust mechanical interface for LED chip mounting. This dimensional addition improves alignment and contact reliability during manufacturing processes, thereby increasing manufacturing yield despite the small size of the LED chips used to achieve high current density.
Solution Approach 2:
The protruding portion is designed in advance to accommodate and protect the small LED chip during transfer and mounting operations. This pre-designed structural feature cushions against potential damage or misalignment that would otherwise occur with such small components, thereby improving manufacturing yield.
3Loss of energy
If the luminous area of LED is reduced to increase current density, then luminous efficacy is improved, but LED size decreases making transfer difficult
Solution Approach 1:
The patent adds a vertical dimension through the protruding substrate electrode portion, which compensates for the reduced horizontal size of the LED chip. This allows the small LED to be securely transferred and mounted via vertical contact rather than relying on larger horizontal dimensions, thus enabling high current density while maintaining ease of transfer.
Solution Approach 2:
The protruding portion is prepared in advance on the substrate electrode to receive the LED chip. This preliminary structural preparation facilitates the transfer process by providing a ready-made contact point and mechanical support, making it easier to handle and position small LED chips with high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high current density in LEDs with small luminous areas, enhances manufacturing efficiency, and simplifies the replacement and transfer process, thereby improving the overall performance and yield of display apparatuses.
Implementation Method 1
A light emitting diode refers to an inorganic semiconductor device that emits light through recombination of electrons and holes
Implementation Method 2
emits light through recombination of electrons and holes
Data Source
AI summary
A display apparatus and a method of manufacturing the same are disclosed. The display apparatus includes at least one light emitting diode chip, a conductive portion disposed under the light emitting diode chip and coupled to the light emitting diode chip, and an insulating material surrounding the conductive portion. The conductive portion includes a first conductive portion and a second conductive portion, and the insulating material is formed to expose at least a portion of the upper surfaces of the first conductive portion and the second conductive portion.