Light-Transmissive Electrode Structure for LED Contact Reliability

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Solution Overview

Problem

Existing light emitting elements face challenges in establishing reliable electrical connections between light-transmissive conducting layers while minimizing light absorption, which affects emission efficiency.

Innovation Solution

A method involving a semiconductor structure with a light-transmissive conducting layer composed of a first layer and a second layer, where the second layer covers the first layer, and an insulation film is formed to expose the conducting layer, allowing for a first conducting layer to be connected, reducing light absorption and enhancing electrical connection reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a light-transmissive conducting layer is formed to establish electrical connection, then electrical connection reliability is improved, but light absorption increases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidlight absorption
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The conducting layer is divided into a multi-layer structure with a first conducting layer in contact with the p-side semiconductor layer and a second conducting layer covering the first layer. This segmentation allows the first layer to provide electrical connection while the second layer can be optimized for light transmissivity, thereby reducing overall light absorption while maintaining connection reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the conducting layer structure are assigned different functions: the first conducting layer is positioned to ensure electrical contact with the semiconductor layer for reliable connection, while the second conducting layer is configured to minimize light absorption. This local differentiation of properties resolves the contradiction between connection reliability and light transmission.

Inventive Principle:
Principle #3Local quality

2Reliability

If a conducting layer covers the upper surface to ensure connection, then electrical connection is improved, but light transmission is reduced

Engineering Contradiction:
Improveelectrical connectionVSAvoidlight transmission
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The conducting layer is segmented into multiple layers with distinct functions. The first conducting layer ensures electrical connection to the p-side semiconductor layer, while the second conducting layer is designed with properties that optimize light transmission, thus resolving the contradiction between connection reliability and light transmission intensity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The solution moves from a single-layer conducting structure to a multi-layer vertical structure. By adding the dimension of layering, the patent enables simultaneous optimization of electrical connection (through the first layer) and light transmission (through the second layer), effectively resolving the contradiction in three-dimensional space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP4459686A1Method of manufacturing light emitting element and light emitting element
Publication Date: 2024.11.06 NICHIA CORP
  • EP4459686A1 patent drawingFigure 1
  • EP4459686A1 patent drawingFigure 2
  • EP4459686A1 patent drawingFigure 3

AI summary

A method of manufacturing a light emitting element includes: providing a semiconductor structure including: an n-side semiconductor layer, an active layer positioned on the n-side semiconductor layer, and a p-side semiconductor layer positioned on the active layer; forming a light-transmissive conducting layer including: a first layer positioned on a portion of the upper surface of the p-side semiconductor layer, and a second layer covering the upper surface of the p-side semiconductor layer and the first layer; forming an insulation film covering the second layer; removing a portion of the insulation film in a region that overlaps the first layer in a plan view to form a first opening in the insulation film and to thereby expose the light-transmissive conducting layer from the insulation film; and forming a first conducting layer in the first opening such that the first conductive layer is electrically connected to the light-transmissive conducting layer.