Light-Transmissive Electrode Structure for LED Contact Reliability
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Solution Overview
Problem
Existing light emitting elements face challenges in establishing reliable electrical connections between light-transmissive conducting layers while minimizing light absorption, which affects emission efficiency.
Innovation Solution
A method involving a semiconductor structure with a light-transmissive conducting layer composed of a first layer and a second layer, where the second layer covers the first layer, and an insulation film is formed to expose the conducting layer, allowing for a first conducting layer to be connected, reducing light absorption and enhancing electrical connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a light-transmissive conducting layer is formed to establish electrical connection, then electrical connection reliability is improved, but light absorption increases
Solution Approach 1:
The conducting layer is divided into a multi-layer structure with a first conducting layer in contact with the p-side semiconductor layer and a second conducting layer covering the first layer. This segmentation allows the first layer to provide electrical connection while the second layer can be optimized for light transmissivity, thereby reducing overall light absorption while maintaining connection reliability.
Solution Approach 2:
Different regions of the conducting layer structure are assigned different functions: the first conducting layer is positioned to ensure electrical contact with the semiconductor layer for reliable connection, while the second conducting layer is configured to minimize light absorption. This local differentiation of properties resolves the contradiction between connection reliability and light transmission.
2Reliability
If a conducting layer covers the upper surface to ensure connection, then electrical connection is improved, but light transmission is reduced
Solution Approach 1:
The conducting layer is segmented into multiple layers with distinct functions. The first conducting layer ensures electrical connection to the p-side semiconductor layer, while the second conducting layer is designed with properties that optimize light transmission, thus resolving the contradiction between connection reliability and light transmission intensity.
Solution Approach 2:
The solution moves from a single-layer conducting structure to a multi-layer vertical structure. By adding the dimension of layering, the patent enables simultaneous optimization of electrical connection (through the first layer) and light transmission (through the second layer), effectively resolving the contradiction in three-dimensional space.
Data Source
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AI summary
A method of manufacturing a light emitting element includes: providing a semiconductor structure including: an n-side semiconductor layer, an active layer positioned on the n-side semiconductor layer, and a p-side semiconductor layer positioned on the active layer; forming a light-transmissive conducting layer including: a first layer positioned on a portion of the upper surface of the p-side semiconductor layer, and a second layer covering the upper surface of the p-side semiconductor layer and the first layer; forming an insulation film covering the second layer; removing a portion of the insulation film in a region that overlaps the first layer in a plan view to form a first opening in the insulation film and to thereby expose the light-transmissive conducting layer from the insulation film; and forming a first conducting layer in the first opening such that the first conductive layer is electrically connected to the light-transmissive conducting layer.