LED Electrode Protection Structure for Contamination-Free Contact Pads
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Solution Overview
Problem
Light-emitting diode (LED) chip electrodes are prone to contamination and loss of conductive performance due to direct contact or friction with external components during manufacturing, packaging, and transportation, leading to decreased conductivity.
Innovation Solution
A light emitting diode structure with a protection structure having a second maximum height greater than the electrode pad portion, which isolates the pad portion from external elements, ensuring it is not directly contacted or contaminated, thereby maintaining conductive performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wire electrodes are provided on the surface of the LED chip for electrical connection, then the LED chip can achieve effective electrical conduction and connectivity, but the wire electrodes directly contact or rub with external components during manufacturing, packaging, and transportation, causing contamination and loss of conductive performance
Solution Approach 1:
The patent introduces an extension portion as an intermediary element between the pad portion and the bonding wire electrode. This extension portion extends from the pad portion toward the bonding wire electrode but maintains a gap without direct contact, serving as a protective mediator that prevents external contaminants from reaching the pad portion while still enabling electrical connection functionality
Solution Approach 2:
The patent employs a three-dimensional structure where the extension portion creates a spatial gap in the horizontal dimension between the pad portion and bonding wire electrode. This dimensional approach allows the structure to maintain electrical connectivity while preventing direct contact and contamination from external components during handling and transportation
2Ease of operation
If the pad portion is directly exposed on the surface for electrical connection, then electrical connectivity is achieved, but the pad portion is vulnerable to direct contact and friction with external components, leading to contamination and performance degradation
Solution Approach 1:
The extension portion serves as a protective intermediary that extends from the pad portion in the direction of the bonding wire electrode. This intermediary structure maintains the electrical connection pathway while physically protecting the pad portion from direct contact with external components, thus preserving conductive performance
3Device complexity
If no protective structure is added to the LED chip, then the device complexity remains low and manufacturing is simple, but the electrode pad portion is directly exposed and susceptible to contamination, resulting in loss of conductive performance
Solution Approach 1:
The electrode structure is segmented into three distinct parts: the pad portion, the extension portion, and the bonding wire electrode. This segmentation allows the extension portion to function as a dedicated protective element that separates the pad portion from external contaminants, improving reliability without significantly complicating the overall device structure
Solution Approach 2:
The extension portion provides localized protection specifically at the critical interface between the pad portion and the bonding wire electrode. This local quality enhancement targets the specific area most vulnerable to contamination during handling, ensuring conductive performance without requiring comprehensive protective measures across the entire device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protection structure effectively prevents contamination of the electrode pad portion, ensuring consistent conductive performance during manufacturing, packaging, and transportation processes.
Implementation Method 1
the protection structure has a second maximum height greater than the first maximum height... the pad portion would be effectively isolated from external elements such as tape or packaging materials
Data Source
AI summary
The present invention provides a light emitting diode structure, including a substrate, a semiconductor light emitting structure, an electrode, and a protection structure. The semiconductor light-emitting structure is located on the substrate, and the semiconductor light-emitting structure includes a top surface. The electrode is located on the top surface, and the electrode includes a pad portion and at least one extension portion. One end of each extension portion is connected to the pad portion, and the pad portion has a first maximum height away from the top surface. The protection structure is located on the top surface and connected to the electrode, and the protection structure has a second maximum height away from the top surface. Wherein the second maximum height is greater than the first maximum height.