Optoelectronic Device with Shaped Support for LED Emission Control
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Solution Overview
Problem
Existing optoelectronic devices with light-emitting diodes require bulky and complex secondary optical systems to control emission diagrams, which are costly and inefficient, and their manufacturing process is complex.
Innovation Solution
An optoelectronic device with a support having concave or convex portions and light-emitting diodes with cylindrical, conical, or tapered semiconductor elements, where the amplitude of deflection is greater than 1/20th of the chord, and the contact surface area ratio is less than 0.7, allowing for controlled emission diagrams without secondary optical systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If secondary optical systems (lenses or other optical systems) are used to modify the emission diagram of light-emitting diodes, then the desired emission diagram can be obtained, but the device becomes bulky and complex, and manufacturing becomes more complex and expensive
Solution Approach 1:
The patent extracts the optical modification function from separate secondary optical systems and integrates it directly into the support structure. The support itself is shaped with concave or convex portions that directly modify the emission diagram of the light-emitting diodes, eliminating the need for additional optical components and simplifying the overall device structure.
Solution Approach 2:
The patent merges the support structure with the optical modification function. Instead of having a separate support and separate optical systems, the support is designed with integrated concave or convex portions that perform both structural support and emission diagram modification functions simultaneously.
2Manufacturing precision
If secondary optical systems are used to modify the emission diagram, then the desired emission pattern can be achieved, but the device bulk increases and manufacturing cost increases
Solution Approach 1:
The optical modification function is extracted from bulky secondary optical systems and embedded into the support structure. This integration eliminates the need for separate optical components that would increase device bulk, while maintaining the ability to control the emission diagram through the geometric shape of the support portions.
3Manufacturing precision
If secondary optical systems are used to modify the emission diagram, then the desired emission pattern can be achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The support structure and optical modification function are merged into a single component. This integration simplifies the manufacturing process by reducing the number of parts that need to be manufactured, assembled, and aligned. The support with integrated concave or convex portions can be manufactured as a single piece, reducing overall manufacturing complexity and cost.
Data Source
AI summary
An optoelectronic device provided with a support including a face having at least one concave or convex portion, the amplitude of the sagitta of said portion being higher than 1/20th of the chord of the portion, and light-emitting diodes arranged on the portion, each light-emitting diode including a cylindrical, conical or frustoconical semiconductor element in contact with the portion, the amplitude of the sagitta of the contact surface between each semiconductor element and the portion being lower than or equal to 0.5 um.


