Optoelectronic Device with Shaped Support for LED Emission Control

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Solution Overview

Problem

Existing optoelectronic devices with light-emitting diodes require bulky and complex secondary optical systems to control emission diagrams, which are costly and inefficient, and their manufacturing process is complex.

Innovation Solution

An optoelectronic device with a support having concave or convex portions and light-emitting diodes with cylindrical, conical, or tapered semiconductor elements, where the amplitude of deflection is greater than 1/20th of the chord, and the contact surface area ratio is less than 0.7, allowing for controlled emission diagrams without secondary optical systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If secondary optical systems (lenses or other optical systems) are used to modify the emission diagram of light-emitting diodes, then the desired emission diagram can be obtained, but the device becomes bulky and complex, and manufacturing becomes more complex and expensive

Engineering Contradiction:
Improveemission diagram controlVSAvoidoptical system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts the optical modification function from separate secondary optical systems and integrates it directly into the support structure. The support itself is shaped with concave or convex portions that directly modify the emission diagram of the light-emitting diodes, eliminating the need for additional optical components and simplifying the overall device structure.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the support structure with the optical modification function. Instead of having a separate support and separate optical systems, the support is designed with integrated concave or convex portions that perform both structural support and emission diagram modification functions simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If secondary optical systems are used to modify the emission diagram, then the desired emission pattern can be achieved, but the device bulk increases and manufacturing cost increases

Engineering Contradiction:
Improveemission diagram controlVSAvoiddevice bulk
Core Design Contradiction:
Manufacturing precisionVSVolume of moving object

Solution Approach 1:

The optical modification function is extracted from bulky secondary optical systems and embedded into the support structure. This integration eliminates the need for separate optical components that would increase device bulk, while maintaining the ability to control the emission diagram through the geometric shape of the support portions.

Inventive Principle:
Principle #2Taking out (Extraction)

3Manufacturing precision

If secondary optical systems are used to modify the emission diagram, then the desired emission pattern can be achieved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveemission diagram controlVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The support structure and optical modification function are merged into a single component. This integration simplifies the manufacturing process by reducing the number of parts that need to be manufactured, assembled, and aligned. The support with integrated concave or convex portions can be manufactured as a single piece, reducing overall manufacturing complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS10115864B2Optoelectronic device with light-emitting diodes and an improved radiation pattern
Publication Date: 2018.10.30 ALEDIA INC
  • US10115864B2 patent drawing
  • US10115864B2 patent drawing
  • US10115864B2 patent drawing

AI summary

An optoelectronic device provided with a support including a face having at least one concave or convex portion, the amplitude of the sagitta of said portion being higher than 1/20th of the chord of the portion, and light-emitting diodes arranged on the portion, each light-emitting diode including a cylindrical, conical or frustoconical semiconductor element in contact with the portion, the amplitude of the sagitta of the contact surface between each semiconductor element and the portion being lower than or equal to 0.5 um.