LED Package Emission Height Alignment for Uniform Color Mixing
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Solution Overview
Problem
Conventional LED packages face challenges in achieving high-quality, uniform light emission with efficient light output due to variations in lumiphoric materials and cover structures, leading to non-uniform emission heights when multiple LED chips with different colors are assembled in close proximity.
Innovation Solution
The solution involves configuring LED chips with varying heights or thicknesses to compensate for differences in lumiphoric materials and cover structures, ensuring that emission heights are within specific tolerances (e.g., within 100 microns) to achieve uniformity across LED packages with different emission colors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LED chips with different lumiphoric materials and cover structures are assembled in close proximity to provide different emission colors, then color variety is improved, but emission height uniformity deteriorates
Solution Approach 1:
The patent applies local quality by configuring different LED chips with varying heights or thicknesses according to their specific lumiphoric material requirements. Each LED chip's height is locally adjusted to compensate for differences in lumiphoric material thickness, ensuring that the top surfaces of all LED chips with different emission colors align at substantially the same height, thus maintaining emission height uniformity while preserving color variety
Solution Approach 2:
The patent changes the height parameter of LED chips to compensate for variations in lumiphoric material thickness. By adjusting the height parameter of individual LED chips, the system maintains uniform emission heights across different emission colors, resolving the contradiction between color variety and emission height uniformity
2Manufacturing precision
If LED chips are configured with varying heights to compensate for lumiphoric material differences, then emission height uniformity is improved, but device complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-configuring LED chips with specific heights or thicknesses before assembly. The height variations are determined in advance based on the required lumiphoric material thicknesses, allowing for systematic compensation that simplifies the overall assembly process while achieving uniform emission heights
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the uniformity of light emission by ensuring that emission heights are substantially the same or within specified ranges, improving the overall light output and color mixing in LED packages.
Implementation Method 1
Lumiphoric materials, such as phosphors, may be arranged in light emission paths of LED emitters to convert portions of light to different wavelengths
Data Source
AI summary
Light-emitting diode (LED) packages and more particularly emission height arrangements in LED packages and related devices and methods are disclosed. LED packages, LED chips, and related device arrangements are disclosed that include various combinations of LED chip types, lumiphoric materials, and/or cover structures that are arranged together while also providing a substantially uniform emission height for corresponding light-emitting surfaces. LED chips may be configured with different heights or thicknesses that compensate for variations in lumiphoric materials and/or cover structures utilized to provide different emission colors. Corresponding LED packages and/or LED chips with different emission colors may be assembled near one another with improved emission height uniformity.