Mini/Micro LED Encapsulation for Peel-Off Chip Repair
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Solution Overview
Problem
Conventional encapsulation methods for Mini/Micro LED displays require extensive repair processes that affect ink color uniformity and risk damage to functional LED chips, leading to high repair costs.
Innovation Solution
A manufacturing method involving a thin-film protective layer and a protective film with a soft adhesive layer is applied to the display module, allowing for easy repair by peeling off the film without breaking the encapsulation, maintaining uniformity and protecting the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a monolithic encapsulation layer is used to protect LED chips, then protection against mechanical impact and moisture is improved, but repair complexity increases and ink color uniformity deteriorates
Solution Approach 1:
The encapsulation structure is divided into two independent parts: a hard protective layer (first encapsulation layer) for mechanical protection and a soft adhesive layer (second encapsulation layer) for easy removal and repair. This segmentation allows each layer to fulfill its specific function without interfering with the other, enabling simple chip replacement while maintaining protection.
Solution Approach 2:
The soft adhesive layer is extracted as a separate removable component that can be easily peeled off to access defective chips for replacement, while the hard protective layer remains in place to continue providing mechanical protection and moisture barrier functions.
2Reliability
If a monolithic encapsulation layer is used to protect LED chips, then protection against moisture and oxygen is improved, but ink color uniformity deteriorates during repair
Solution Approach 1:
The encapsulation is segmented into a moisture-barrier hard layer and a removable soft layer. This allows the hard layer with its uniform ink color to remain intact during repairs, while only the soft layer needs to be removed and reattached, preventing ink color disruption.
Solution Approach 2:
Different regions of the encapsulation structure have different properties: the hard protective layer provides moisture barrier and structural integrity with uniform appearance, while the soft adhesive layer provides ease of removal and reattachment. Each layer is optimized for its specific local function.
3Ease of repair
If the encapsulation layer is completely removed for chip replacement, then repair access is improved, but risk of damaging functional chips increases and repair cost increases
Solution Approach 1:
The soft adhesive layer is extracted as a separate removable component that can be easily peeled off to access defective chips for replacement, while the hard protective layer remains in place to continue providing mechanical protection and moisture barrier functions.
Solution Approach 2:
The hard protective layer serves as a pre-established protective barrier that cushions and protects the LED chips during the repair process, preventing mechanical damage when the soft layer is removed and reattached.
4Reliability
If traditional encapsulation method is used, then chip protection is improved, but repair time and productivity deteriorate
Solution Approach 1:
The encapsulation is segmented into a moisture-barrier hard layer and a removable soft layer. This allows the hard layer with its uniform ink color to remain intact during repairs, while only the soft layer needs to be removed and reattached, preventing ink color disruption.
Solution Approach 2:
The soft adhesive layer is extracted as a separate removable component that can be easily peeled off to access defective chips for replacement, while the hard protective layer remains in place to continue providing mechanical protection and moisture barrier functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method simplifies the repair process, maintains ink color uniformity, and prevents damage to LED chips during maintenance, enhancing production efficiency and reducing material waste.
Implementation Method 1
spraying the substrate with a thin-film protective material
Implementation Method 2
curing the thin-film protective material to form a thin-film protective layer
Implementation Method 3
attaching the protective film to the front surface of the substrate via the soft adhesive layer
Implementation Method 4
performing an aging treatment on the substrate and the light-emitting chips mounted thereon
Data Source
Figure 1
Figure 2
Figure 3a~4
AI summary
A display module manufacturing method, comprising: step I, providing a substrate with several light-emitting chips mounted on a front surface thereof; step II, spray-coating the substrate with a thin-film-shaped protective material, and curing the thin-film-shaped protective material to form a thin-film protective layer attached to the front surface of the substrate and front and side faces of the light-emitting chips; and step III, providing a protective membrane with a soft adhesive layer as a bottom layer thereof, attaching the protective membrane to the front surface of the substrate by means of the soft adhesive layer, filling with the soft adhesive layer a gap between adjacent light-emitting chips, and curing the soft adhesive layer to form a filled layer. Further disclosed in the present application are a corresponding display module, and a repair method for the display module. Compared with the prior art, the present application involves convenient packaging and high production efficiency; a packaged display module is easily repaired, and the repaired display module has good surface ink color consistency.