LED ESD Protection via Dielectric Interlayer
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Solution Overview
Problem
Conventional light emitting diodes (LEDs) are prone to damage from Electro-Static Discharge (ESD), which affects their electrical stability and reliability in lighting applications.
Innovation Solution
A light emitting device structure incorporating a conductive support substrate, a dielectric material, and insulating layers to create a capacitor structure that protects the active layer from ESD, comprising a first and second conductive semiconductor layer with an active layer in between, and a contact with a dielectric material interposed between the contact and the conductive support substrate, enhancing electrical insulation and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional LED structure is used, then the device is simple in structure, but the device is prone to ESD damage and has poor electrical stability
Solution Approach 1:
The patent introduces a dielectric layer as an intermediary component between the contact and the conductive support substrate. This dielectric layer acts as a mediator that prevents direct electrical contact, thereby protecting the LED structure from ESD damage while maintaining overall structural organization. The intermediary layer specifically isolates the contact from the conductive support substrate, preventing harmful electrical discharge pathways.
Solution Approach 2:
The patent segments the electrical connection path by introducing separate functional layers (dielectric layer and insulating layer) that divide the direct contact between the contact and conductive support substrate. This segmentation creates distinct functional zones: one for electrical connection and another for ESD protection, thereby improving reliability without creating a monolithic complex structure.
2Reliability
If ESD protection structures are added to LEDs, then electrical stability improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the ESD protection function with the existing support substrate structure. The conductive support substrate serves dual purposes: providing mechanical support and acting as part of the ESD protection system when combined with the dielectric layer. This merging approach allows ESD protection to be integrated into the manufacturing process without requiring entirely separate manufacturing steps.
Solution Approach 2:
The dielectric layer serves as a simple intermediary component that can be deposited using standard semiconductor manufacturing techniques. This intermediary layer provides ESD protection through a straightforward deposition process, avoiding complex multi-step manufacturing sequences while achieving the desired protection function.
3Reliability
If direct contact between contact and conductive support substrate is maintained, then electrical connection is simple, but ESD damage occurs
Solution Approach 1:
The dielectric layer is positioned as an intermediary between the contact and the conductive support substrate, preventing direct electrical contact while maintaining the overall structural simplicity. This intermediary layer specifically blocks ESD pathways without requiring complex reconfiguration of the device architecture.
Solution Approach 2:
The patent addresses the electrical connection issue by moving to another dimension - adding a vertical layer (dielectric layer) rather than redesigning the horizontal connection geometry. This dimensional approach allows ESD protection to be achieved by stacking layers rather than redistributing connections, thereby minimizing structural complexity changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces damage from ESD, improving the electrical stability and reliability of the light emitting device, ensuring superior performance and longevity in lighting systems.
Implementation Method 1
a dielectric material making contact with the contact and interposed between the contact and the conductive support substrate
Implementation Method 2
an insulating layer electrically insulating the contact from the active layer, the second conductive semiconductor layer, and the conductive support substrate
Implementation Method 3
incorporating a conductive support substrate, a dielectric material, and insulating layers to create a capacitor structure that protects the active layer from ESD
Data Source
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AI summary
Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes the light emitting structure layer including a first conductive semiconductor layer (110), a second conductive semiconductor layer (130), and an active layer (120) between the first and second conductive semiconductor layers, a conductive support substrate (205) electrically connected to the second conductive semiconductor layer, a contact (502) electrically connected to the first conductive semiconductor layer, a dielectric material (503) making contact with the contact and interposed between the contact and the conductive support substrate, and an insulating layer (501,504) electrically insulating the contact from the active layer, the second conductive semiconductor layer, and the conductive support substrate.