LED Epitaxial Wafer Collective Mounting via Expanding Tape
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Solution Overview
Problem
Conventional LED manufacturing methods require high precision and increased mounting time due to the need for individual placement of electrode plates on substrates, making the process inefficient for mass production.
Innovation Solution
A method where LED elements are collectively mounted on a printed-circuit board assembly using an expanding tape, allowing simultaneous bonding of element electrodes and subsequent formation of a light-transmitting resin to cover and separate the LEDs, reducing the need for precise individual placement and enhancing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED elements are mounted individually on substrate with precise electrode plate placement, then mounting precision is improved, but assembly time increases and productivity decreases
Solution Approach 1:
The patent merges multiple LED elements onto a single substrate simultaneously, eliminating the need for individual mounting operations. The expanding tape technology allows multiple LED elements to be positioned and bonded to the substrate in one operation, dramatically improving productivity while maintaining acceptable precision through the tape's expansion control mechanisms.
Solution Approach 2:
The patent applies preliminary action by pre-attaching LED elements to an expanding tape before final substrate mounting. This preliminary configuration allows for efficient batch processing and positioning, where the tape is expanded to the precise final dimensions before bonding to the substrate, combining speed with precision.
2Productivity
If expanding tape is used for collective mounting of LED elements, then assembly time is reduced and productivity improves, but mounting precision may deteriorate
Solution Approach 1:
The patent utilizes parameter changes by controlling the expansion ratio and dimensions of the expanding tape. The tape can be expanded to precise final dimensions, and the LED elements are positioned on the tape before expansion, ensuring that even though multiple elements are mounted simultaneously, their final positions achieve the required precision for electrode alignment.
3Productivity
If multiple LED elements are mounted simultaneously on substrate, then productivity is improved, but complexity of the mounting process increases
Solution Approach 1:
The expanding tape serves as an intermediary carrier that simplifies the complex task of simultaneous multi-element mounting. The tape provides a pre-configured platform for attaching multiple LED elements, and its controlled expansion mechanism handles the positioning complexity, allowing batch assembly without proportionally increasing process complexity.
Data Source
AI summary
A manufacturing method of an LED comprises attaching an LED epitaxial wafer (LED wafer) to an expanding tape, dicing the LED wafer on the expanding tape longitudinally and laterally to a certain element size to divide into a plurality of LED elements, expanding the expanding tape to a certain size to form an enlarged expanding tape, placing respective pairs of element electrodes of the plurality of LED elements that are attached to the enlarged expanding tape on respective pairs of electrodes on a printed-circuit board assembly collectively to perform a bonding, and removing the enlarged expanding tape from the plurality of the LED elements.