LED Device Frame-Shaped Electrode Sealing
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Solution Overview
Problem
Conventional LED devices are prone to staining and short circuits when foreign matter, such as liquids, come into contact with their bottom, leading to potential electrical issues during mounting on a mother substrate.
Innovation Solution
The LED device features a frame-shaped electrode arranged along three sides of its bottom, sealed with solder, preventing foreign matter from invading the interior and reducing the risk of short circuits by ensuring the perimeter is sealed, thereby protecting the internal components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the LED device bottom is left open without sealing structure, then the manufacturing process is simple, but foreign matter such as liquid can invade the bottom causing staining and short circuits
Solution Approach 1:
The electrode structure is divided into a frame-shaped electrode that forms a sealed perimeter and an inner electrode that is surrounded by the frame-shaped electrode. This segmentation creates distinct functional zones: the frame-shaped electrode provides sealing and protection against foreign matter, while the inner electrode maintains electrical connectivity. The segmented structure resolves the contradiction by adding protection without creating a fully enclosed complex structure.
Solution Approach 2:
The frame-shaped electrode acts as a flexible sealing barrier that prevents foreign matter from reaching the inner electrode and sensitive components. This thin film-like electrode structure provides effective protection while maintaining manufacturing simplicity, as it can be formed using standard PCB fabrication techniques without requiring complex three-dimensional enclosures.
2Object-affected harmful factors
If a frame-shaped electrode is added to seal the bottom perimeter, then foreign matter invasion is prevented, but the electrode structure becomes more complex
Solution Approach 1:
The frame-shaped electrode serves multiple functions simultaneously: it provides mechanical support, creates a sealed barrier against foreign matter, establishes electrical connections through soldering, and defines the structural perimeter of the LED device. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall device complexity while achieving effective protection.
Solution Approach 2:
The sealing function, electrical connection function, and structural support function are merged into a single frame-shaped electrode component. By combining these functions into one element rather than using separate components for each function, the design achieves effective protection against liquid invasion while minimizing the increase in device complexity.
3Reliability
If the entire bottom perimeter is sealed with electrode, then complete protection is achieved, but manufacturing cost and complexity increase significantly
Solution Approach 1:
Instead of sealing the entire bottom surface, the invention applies sealing action only to the critical perimeter region where foreign matter most commonly invades. The frame-shaped electrode is positioned along the periphery to provide partial sealing that targets the most vulnerable areas, achieving effective protection against staining and short circuits while maintaining manufacturing simplicity and avoiding the need for complete bottom enclosure.
Data Source
Figure 1
Figure 2
Figure 3(a)~3(c)
AI summary
Provided is an LED device presenting minimal risk of bottom-surface contamination even when foreign substances such as liquids adhere thereto. The LED device (1) has an LED die (9), a submount substrate (4) on the surface of which the LED die is mounted, a frame-shaped electrode (5) disposed along the outer circumferential part of the bottom surface of the submount substrate, and an innerside electrode (8) surrounded by the frame-shaped electrode and connected to the electrode of the LED die (9). In the LED device (1), the frame-shaped electrode is disposed along the entire outer circumferential part of the bottom surface. In an LED device (120), the bottom surface is rectangular, and the frame-shaped electrode is disposed along three sides of the bottom surface.