LED Package Color Conversion Frit Transfer Method
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Solution Overview
Problem
The existing methods for fabricating LED packages require additional heat treatment or cutting processes after bonding the color conversion frit to the LED chip, which can lead to degradation of the LED chips and warping of the base substrate, as well as issues like peeling or fracturing during the cutting process.
Innovation Solution
A method involving forming a color conversion frit with a fluorescent material on a substrate, transferring it to a pressure-sensitive adhesive film, and bonding it to the LED chip without subsequent heat treatment or cutting, allowing the frit to be patterned and sintered before transfer, thus eliminating the need for additional processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the mixture of frit and fluorescent material is sintered at high temperature (500°C or above) to bond directly to the LED chip, then the bonding strength is improved, but the LED chip degrades due to excessive heat
Solution Approach 1:
The process is segmented into two independent stages: (1) forming and sintering the color conversion frit layer on a separate substrate at high temperature, and (2) bonding the pre-formed frit layer to the LED chip at low temperature. This segmentation allows each stage to be optimized independently, enabling high-temperature sintering without damaging the LED chip.
Solution Approach 2:
The color conversion frit layer is preliminarily formed and sintered on a substrate before being transferred to the LED chip. By completing the high-temperature sintering process in advance on a heat-resistant substrate, the LED chip is protected from thermal exposure while still achieving strong bonding when the frit is later attached.
2Strength
If heat treatment is performed after coating the LED chip with the mixture of frit and fluorescent material, then the bonding is improved, but the base substrate warps
Solution Approach 1:
The heat treatment process is separated from the LED chip assembly. The frit layer is sintered on a separate substrate that can withstand high temperatures without warping, then the completed frit layer is transferred to the LED chip without requiring additional heat treatment on the final assembly.
Solution Approach 2:
A separate substrate acts as an intermediary carrier for the color conversion frit layer during the sintering process. This intermediary substrate absorbs the thermal stress and prevents warping of the LED chip's base substrate, allowing high-temperature processing without deformations.
3Manufacturing precision
If additional heat treatment and cutting processes are performed after bonding the color conversion frit to the LED chip, then the manufacturing precision is improved, but the complexity of the fabrication process increases
Solution Approach 1:
The color conversion frit layer is preliminarily patterned and sintered on a substrate with the required precision before transfer. This preliminary preparation ensures manufacturing precision is achieved in the patterning stage, eliminating the need for subsequent heat treatment or cutting processes on the finished LED assembly.
Solution Approach 2:
Multiple operations (patterning, sintering, and precision positioning) are merged into a single integrated process of forming the frit layer on the substrate before transfer. This consolidation eliminates the need for separate post-bonding processes, reducing fabrication complexity while maintaining precision.
4Productivity
If the LED chip is cut after bonding the color conversion frit, then the individual LEDs are separated, but peeling or fracturing occurs in the color conversion frit
Solution Approach 1:
The LED array is segmented into individual chips at the substrate level before the color conversion frit is applied. Each LED chip is separated on its own substrate, and the frit layer is formed individually on each chip or in precise patterns, eliminating the need for cutting through the bonded frit and preventing peeling or fracturing.
Solution Approach 2:
Instead of bonding the frit to a complete LED array and then cutting, the process is inverted: individual LED chips are prepared separately, then the frit is bonded to each chip individually or in pre-separated groups. This reversal of the sequence eliminates the mechanical stress of cutting through the frit layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents substrate warping and frit cracking, simplifies the fabrication process, and minimizes defects, enabling the production of LED packages with improved reliability and uniformity.
Implementation Method 1
a fluorescent material generating yellowish-green or yellow light may be used as a light excitation source on a blue LED, whereby white light can be produced by mixing blue light emitted by the blue LED and yellowish-green or yellow excitation light from the fluorescent material
Implementation Method 2
the mixture of the frit and the fluorescent material has been formed into a paste, followed by coating the LED chip with the mixture of the frit and the fluorescent material and subsequent sintering
Implementation Method 3
transferred the color conversion frit formed on the substrate to a transfer film; and bonding the color conversion frit on the transfer film to an LED chip
Data Source
AI summary
The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional color conversion frit heat-treatment process and cutting process after bonding between the color conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package characterized in that the present invention comprises: a color conversion frit formation step for forming a color conversion frit in which phosphor is included on a substrate; a color conversion frit transcription step for transcribing the color conversion frit formed on the substrate from the substrate to a transcription film; and a color conversion frit bonding step for bonding the color conversion frit transcribed on the transcription film onto a light-emitting diode package.