LED Grain Structure with Multiple Contact Points for Current Dispersion
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Solution Overview
Problem
Vertical light-emitting diodes face issues with non-uniform light emission leading to local hotspots and risk of damaging the PN junction during wire bonding, and existing multi-conducting pillar technologies are fragile, costly, and not suitable for all semiconductor types due to high defect density and complexity.
Innovation Solution
A light-emitting diode grain structure with multiple contact points featuring a P-type electrode, conductive base plate, ohmic contact metal points, mesh connection conductive layer, and N-type electrode pad, where the connection conductive layer does not form an ohmic contact with the N-type semiconductor layer, allowing current dispersion through ohmic contact metal points and reducing shading area with a mesh structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a center electrode pad is used for current dispersion, then luminous efficiency is improved, but light becomes excessively concentrated on the electrode pad causing local hot spots and reduced reliability
Solution Approach 1:
The patent divides the single center electrode pad into multiple smaller contact points arranged in an array. This segmentation allows current to disperse across multiple locations rather than concentrating through a single pad, reducing local hot spots and improving reliability while maintaining overall current dispersion for luminous efficiency.
Solution Approach 2:
The patent transitions from a two-dimensional electrode pad surface to a three-dimensional array of contact points extending through the semiconductor layer. This dimensional change allows current to flow through multiple depth levels and lateral positions, achieving better current distribution without excessive concentration at any single surface location.
2Ease of operation
If wire bonding is performed on the electrode pad surface, then electrical connection is achieved, but there is a risk of damaging the PN junction resulting in decreased yield and reliability
Solution Approach 1:
The patent pre-positions multiple contact points at optimized locations on the semiconductor layer before wire bonding is performed. This preliminary arrangement ensures that wire bonding can be executed on suitable contact points without requiring precise alignment on critical areas, reducing the risk of PN junction damage while maintaining ease of assembly.
Solution Approach 2:
Different regions of the semiconductor layer are provided with different types of contact points optimized for different functions. Some contact points are specifically designed and positioned to be suitable for wire bonding, while others are optimized for current injection, allowing wire bonding to be performed on appropriate locations without compromising the PN junction.
3Stability of the object's composition
If multiple reference lines are added to improve current dispersion, then current distribution is improved, but the shading area increases reducing light output
Solution Approach 1:
The patent uses a mesh-like array of contact points that creates a porous or open structure. This allows current dispersion functionality similar to reference lines while maintaining significant open area for light transmission. The spaced arrangement of contact points provides current distribution benefits without the continuous shading effect of solid reference lines.
4Stability of the object's composition
If multi-conducting pillar technology is used for current dispersion, then current uniformity is improved, but the structure becomes fragile and complex increasing cost and reducing reliability
Solution Approach 1:
Instead of using complex multi-conducting pillar structures with insulating coatings and precise cylindrical geometries, the patent employs a simplified array of contact points that replicates the current dispersion function. This copied functionality achieves similar current uniformity without the structural complexity, fragility, and manufacturing precision requirements of the pillar approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively disperses current, reduces shading, enhances light distribution uniformity, increases component reliability, and is suitable for various semiconductor types, including nitrides, phosphides, and arsenides, while avoiding damage during packaging.
Implementation Method 1
a plurality of ohmic contact metal points arranged on the N-type semiconductor layer in a spreading manner, wherein the plurality of ohmic contact metal points contacts with the N-type semiconductor layer
Implementation Method 2
The connection conductive layer is a mesh structure and covering the N-type semiconductor layer, the connection conductive layer is electrically connected to the plurality of ohmic contact metal points without ohmic contact formed between the connection conductive layer and the N-type semiconductor layer
Data Source
AI summary
The invention provides a light-emitting diode grain structure with multiple contact points, including a P-type electrode, a conductive base plate, a light-emitting semiconductor layer, a plurality of ohmic contact metal points, a mesh-structured connection conductive layer, a connection point conductive layer, and an N-type electrode pad electrically connected to the connection point conductive layer. The plurality of ohmic contact metal points is arranged on an N-type semiconductor layer in a spreading manner, and is contacted with the N-type semiconductor layer. No ohmic contact is formed between the connection conductive layer and the N-type semiconductor layer. Accordingly, the metal points and the connection conductive layer can disperse a current, reduce a shading area, and improve the luminous efficiency and component reliability; and uniform light emission from a surface facilitates the light distribution uniformity of an original light source and exciting light after phosphor is coated.