Light-emitting Device Heat Dissipation Hole Design
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Solution Overview
Problem
Existing light-emitting devices with high thermal conductivity metal plates for heat dissipation are inefficient in dissipating heat from the front side, limiting overall heat management.
Innovation Solution
A light-emitting device design featuring a thermally conductive substrate with heat dissipation holes in the resist outside the element mounting region, exposing the substrate surface, and optionally an anodic oxide film and surface roughening for enhanced heat dissipation from both sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the metal plate with high thermal conductivity is mostly exposed on the back side to facilitate heat dissipation, then heat dissipation from the back side is improved, but heat dissipation from the front side remains inefficient
Solution Approach 1:
The substrate surface is segmented into different functional regions: an element mounting region that remains covered for light emission, and heat dissipation regions with exposed metal plate and heat dissipation holes. This segmentation allows simultaneous optimization of light emission and heat dissipation functions without compromising either performance
Solution Approach 2:
Different regions of the substrate are given different thermal properties: the element mounting region maintains full metal plate coverage for thermal conduction to the light-emitting element, while surrounding regions feature exposed metal plate and heat dissipation holes to maximize heat dissipation to the environment. Each region's structure is optimized for its specific function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient heat dissipation from both the front and back sides of the substrate, improving thermal management and reducing thermal stress on the light-emitting elements.
Implementation Method 1
a thermally conductive substrate; wherein a heat dissipation hole is formed in a region of the resist outside the element mounting region so as to expose a surface of the thermally conductive substrate
Implementation Method 2
The anodic oxide film comprises a black surface
Data Source
AI summary
A light-emitting device includes a thermally conductive substrate, a wiring electrode formed on the thermally conductive substrate, a resist formed on the wiring electrode except a terminal thereof, and a light-emitting element that is disposed in an element mounting region of the thermally conductive substrate and electrically connected to the terminal of the wiring electrode. A heat dissipation hole is formed in a region of the resist outside the element mounting region so as to expose a surface of the thermally conductive substrate.