LED Housing Production via Embedded Emitters and Dielectric Trenches
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Solution Overview
Problem
The production of LED housings is costly and inflexible due to the use of injection molding, which limits the variability of optical properties and efficiency, as well as the need for separate carriers for semiconductor emitters.
Innovation Solution
A method involving embedding semiconductor emitters in a light-transmissive filling compound, introducing trenches, covering with a dielectric material, and leading electrical lines through it, allowing for the omission of injection molds and enabling adaptable housing designs and emission properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If injection molding method is used to produce housing, then manufacturing precision and structural integrity are improved, but production cost increases and flexibility to vary housing shape decreases
Solution Approach 1:
The housing is divided into multiple segments or layers that can be produced separately and then assembled. This allows each segment to be optimized for its specific function while reducing the complexity and cost of producing the entire housing as a single molded piece, thereby lowering tooling costs while maintaining structural integrity through precise assembly interfaces.
Solution Approach 2:
The housing structure is merged with the filling compound and semiconductor emitters into an integrated assembly. By combining previously separate components (housing, filling material, and emitter mounting) into a unified structure, the patent eliminates the need for expensive injection molding tools while maintaining precise positioning and structural integrity through the interlocking design of the integrated components.
2Manufacturing precision
If injection molding method is used to produce housing, then structural integrity is improved, but adaptability to vary housing shape and size decreases
Solution Approach 1:
The housing design incorporates dynamic adaptability by using modular segments that can be reconfigured or adjusted to create different housing shapes and sizes. This allows the same basic structure to be adapted for various LED package configurations without requiring new injection molds, thereby maintaining structural integrity while achieving shape variability.
Solution Approach 2:
The housing dimensions and shapes are made variable by changing the parameters of the filling compound and the arrangement of semiconductor emitters rather than redesigning the entire housing structure. This allows flexible adaptation of housing geometry to match different LED package requirements while maintaining the structural integrity provided by the standardized housing framework.
3Manufacturing precision
If separate carrier is used for semiconductor emitters, then emitter positioning and electrical connections are improved, but device complexity and production cost increase
Solution Approach 1:
The carrier function is merged with the filling compound by integrating the emitter positioning and electrical connection features directly into the filling material structure. This eliminates the need for a separate carrier component while maintaining precise emitter positioning and electrical connections, thereby reducing device complexity and the number of assembly steps without sacrificing manufacturing precision.
Solution Approach 2:
The filling compound is designed to perform multiple functions simultaneously: it provides structural support, positions the semiconductor emitters precisely, establishes electrical connections, and fills the housing cavity. By making the filling compound multi-functional, the patent eliminates the need for separate carrier components while maintaining all the benefits of having a dedicated carrier for emitter positioning and connection.
Data Source
AI summary
A method for producing a lighting device is provided. According to the method, a plurality of semiconductor emitters arranged alongside one another are embedded in a light-transmissive filling compound apart from a side having their electrical connections, trenches are introduced into the light-transmissive filling compound at the side having the electrical connections between at least two semiconductor emitters, the side of the light-transmissive filling compound having the electrical connections, including the electrical connections, is covered with a dielectric material, electrical lines are led through the dielectric material to the electrical connections, and at least some of the trenches are severed.