LED Housing Isolating Electrical and Thermal Paths

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Solution Overview

Problem

The existing LED package fabrication process is complex and costly due to the need for multiple components and a complicated assembly structure, which hinders automation and increases manufacturing costs.

Innovation Solution

An LED housing design that isolates electrical connecting parts from the heat conducting part, using a frame with electrical connecting parts and holders for the heat conducting part, and a molding resin housing body to simplify the assembly process and enhance efficiency, with a fabrication method involving machining, resin injection, and separation of components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If multiple components are assembled together to achieve thermal radiation, then thermal radiation performance is improved, but device complexity increases and manufacturing cost increases

Engineering Contradiction:

Improvethermal radiation performanceVSAvoidassembly structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines multiple separate components (housing, thermal connecting member, electrical connecting member, leads) into a single integrated LED package structure. The housing body simultaneously provides structural support, thermal management pathways, and electrical isolation functions, eliminating the need for separate assembly steps and reducing overall device complexity while maintaining effective thermal radiation performance.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing body serves multiple functions simultaneously: it provides mechanical support for the LED chip, acts as a thermal management component through integrated heat dissipation pathways, provides electrical isolation between conductive elements, and serves as the outer protective enclosure. This multi-functionality reduces the number of separate components needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If multiple components are assembled together to achieve thermal radiation, then thermal radiation performance is improved, but manufacturing cost increases

Engineering Contradiction:

Improvethermal radiation performanceVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated housing is designed with distinct functional zones: a chip mounting area for the LED chip, a heat connecting area for thermal management, and an electrical connecting area for electrical connections. This segmentation allows for optimized manufacturing processes while maintaining functional separation of concerns.

Inventive Principle:

Principle #1Segmentation

3Device complexity

If electrical connecting parts are integrated with heat conducting part, then assembly is simplified, but thermal management performance deteriorates due to heat interference

Engineering Contradiction:

Improveassembly structureVSAvoidthermal management performance

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent extracts electrical connecting members from direct thermal contact with the heat conducting pathways. The housing body provides physical separation and thermal isolation between the electrical connecting area and the heat connecting area, allowing electrical components to be integrated into the overall structure without compromising thermal management performance.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The housing body is designed with different thermal and electrical properties in different regions: the heat connecting area has high thermal conductivity pathways, while the electrical connecting area provides thermal isolation. This local differentiation of material properties and structural characteristics allows simultaneous optimization of both thermal management and electrical connectivity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the LED housing fabrication process, reduces manufacturing costs, and enables mass production by isolating electrical and heat conducting parts, improving assembly efficiency and automation.

Implementation Method 1

a housing body made of molding resin, and integrally holding the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS7678592B2LED housing and fabrication method thereof

Publication Date: 2010.03.16 SAMSUNG ELECTRONICS CO LTD

AI summary

In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.