LED Package Housing Protrusions for Lead Frame Formation
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Solution Overview
Problem
Existing light emitting device packages face challenges in properly forming lead frames and preventing damage to the housing during the manufacturing process.
Innovation Solution
A light emitting device package design featuring a housing with side openings and protrusions, along with a manufacturing method that includes punching a metal plate to form lead frames and support members, injection molding, and careful separation to minimize housing damage, allows for proper lead frame formation and housing protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the lead frame is formed by punching and separating from a metal plate during manufacturing, then the lead frame can be properly formed, but the housing may be damaged during the separation process
Solution Approach 1:
The housing is designed with protrusions at the side openings before the lead frame separation process. These protrusions are formed in advance to guide and support the lead frame members during the punching and separation operations, preventing housing damage while enabling proper lead frame formation.
Solution Approach 2:
The protrusions act as intermediary structures between the lead frame members and the housing. They provide a mechanical interface that facilitates the separation of lead frames from the metal plate without directly transmitting damaging forces to the housing body, thus mediating the interaction between these components during manufacturing.
2Object-affected harmful factors
If protrusions are added to the housing at the side openings, then the housing is protected from damage during manufacturing, but the device complexity increases
Solution Approach 1:
The housing structure is segmented by adding localized protrusions at specific side openings rather than modifying the entire housing structure. This segmentation approach allows the housing to maintain its overall simplicity while incorporating protective features only where needed during the manufacturing process.
Solution Approach 2:
The protrusions are implemented as local structural modifications at the side openings of the housing, rather than a global structural change. This local quality approach protects the housing from damage during lead frame formation while minimizing the increase in overall device complexity by confining the structural modification to specific locations.
Data Source
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AI summary
Provided is a light emitting device package. The light emitting device package comprises a housing, first and second lead frames, and a light emitting device. The housing comprises a front opening and side openings. The first and second lead frames pass through the housing to extend to an outside. A portion of each lead frame being exposed through the front opening. The light emitting device is in the front opening and electrically connected to the first and second lead frames. A protrusion protruding in a direction of the side opening is formed on an inner surface of the side opening.