Integrated LED and IC Packaging on MCPCB Substrate
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Solution Overview
Problem
Conventional LED packaging methods require separate processes for LED emitters and IC devices, leading to increased complexity, space consumption, and costs due to independent packaging.
Innovation Solution
A method and apparatus for packaging LEDs and IC devices together on a shared carrier with integrated thermal and electrical routing, using a Metal Core Printed Circuit Board (MCPCB) with thermally conductive and electrically insulating dielectric layers, where IC devices are bonded using solder bumps and encapsulated with a reflective cap structure, and LEDs are flip-chip bonded with conductive materials, sharing the same packaging material and interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LED emitters and IC devices are packaged separately by different packaging processes, then each component can be optimized independently, but the packaging complexity increases and more space is consumed
Solution Approach 1:
The patent merges the packaging processes of LED emitters and IC devices into a single unified packaging structure. Both components are mounted on the same substrate and encapsulated together using the same encapsulant material, eliminating the need for separate packaging processes while maintaining independent component optimization.
Solution Approach 2:
The packaging structure serves multiple functions simultaneously: it provides mechanical support, electrical insulation, thermal management, and environmental protection for both LED emitters and IC devices. The substrate and encapsulant material are designed to fulfill multiple packaging requirements for different components.
2Reliability
If LED emitters and IC devices are packaged separately, then each component receives dedicated packaging attention, but manufacturing costs increase
Solution Approach 1:
The patent combines multiple packaging operations into a single manufacturing flow where LED emitters and IC devices are packaged simultaneously in one process sequence, reducing the total number of manufacturing steps, equipment requirements, and associated costs while maintaining packaging quality.
3Reliability
If separate packaging processes are used for LED emitters and IC devices, then each component can be packaged with appropriate materials, but packaging time increases
Solution Approach 1:
The patent performs preliminary mounting of both LED emitters and IC devices on the substrate before the encapsulation step. This allows the subsequent encapsulation process to be a single unified operation rather than sequential separate operations, significantly reducing total packaging time while maintaining material compatibility for each component type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces packaging time, results in a more integrated and compact lighting module, and lowers costs by simplifying the packaging process while maintaining efficient thermal dissipation and electrical control.
Implementation Method 1
Metal Core Printed Circuit Board (MCPCB) with thermally conductive and electrically insulating dielectric layers
Implementation Method 2
IC devices are bonded using solder bumps and encapsulated with a reflective cap structure, and LEDs are flip-chip bonded with conductive materials
Data Source
AI summary
The present disclosure involves a method of packaging light-emitting diodes (LEDs). A carrier having a first side and a second opposite the first side is provided. The carrier includes a plurality of conductive interconnect elements. An integrated circuit (IC) die is bonded to the first side of the carrier. A packaging material having light-reflective properties is molded over the first and second sides of the carrier such that the IC die is sealed by the packaging material. A portion of the packaging material is molded into a reflective cap structure. A light-emitting diode (LED) is bonded to the second side of the carrier. Sidewalls of the reflective cap structure circumferentially surround the LED. The LED and the IC die are electrically coupled together through the conductive interconnect elements in the carrier. A lens is then formed over the LED.