Light Emitting Device Insulating Coating Withstand Voltage
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Solution Overview
Problem
Conventional light emitting devices face challenges in achieving high output and reliability while maintaining sufficient withstand voltage when using commercial power supplies, as the exposure of electrically conductive layers during electrolytic plating or electrodeposition methods can lead to short circuits and increased material costs due to thicker insulating substrates.
Innovation Solution
A method of manufacturing light emitting devices involves providing an insulating substrate with an electrically conductive member, covering it with a reflecting member using electrodeposition or electrostatic coating, insulating at least a portion of the conductive member, and singulating the substrate to ensure the conductive member is spaced apart from the end portions, thereby securing the required withstand voltage and enhancing light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If electrolytic plating method is used to form Ag plated surface with high reflectance, then light extraction efficiency is improved, but electrically conductive wiring is exposed at side surface of insulating member causing short circuit risk
Solution Approach 1:
An insulating coating layer is introduced as an intermediary between the exposed electrically conductive wiring and the metal member (heat sink). This coating layer prevents direct contact and potential short circuits while allowing the electrolytic plating process to proceed and achieve high reflectance for improved light extraction efficiency.
Solution Approach 2:
The solution moves from a two-dimensional surface problem (exposed wiring on substrate surface) to a three-dimensional solution by applying an insulating coating that extends vertically from the substrate surface, covering the exposed wiring and creating spatial separation from the metal member.
2Reliability
If thickness of insulating substrate is increased to satisfy withstand voltage requirements, then safety standards are met, but material cost increases and heat dissipation performance deteriorates
Solution Approach 1:
Instead of uniformly increasing the insulating substrate thickness throughout, the insulating coating is applied locally only where needed - specifically on the electrically conductive wiring portions that are exposed at the side surface. This localized approach provides the necessary insulation for withstand voltage requirements without unnecessarily increasing overall substrate thickness, thereby maintaining heat dissipation performance and reducing material costs.
3Temperature
If electrically conductive member is positioned closer to end portion of substrate, then heat dissipation is improved, but withstand voltage requirement of 1.5mm or 2mm spacing cannot be satisfied
Solution Approach 1:
The insulating coating acts as a mediator that allows the electrically conductive member to be positioned closer to the end portion of the substrate for improved heat dissipation, while still maintaining the required 1.5mm or 2mm spacing for withstand voltage. The coating provides the necessary electrical insulation, enabling thermal optimization without compromising electrical safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient application of a reflecting layer on light emitting devices while ensuring the necessary withstand voltage, improving heat dissipation and reducing material costs, thus enhancing the performance and reliability of light emitting devices.
Implementation Method 1
covering the electrically conductive member with a reflecting member by using electrodeposition or electrostatic coating
Implementation Method 2
covering the electrically conductive member with a reflecting member by using electrodeposition or electrostatic coating
Implementation Method 3
a light emitting element mounted on the insulating substrate
Implementation Method 4
covering the electrically conductive member with a reflecting member to improve light extraction efficiency
Data Source
AI summary
A method of manufacturing a light emitting device includes providing an insulating substrate having an electrically conductive member on a surface of the insulating substrate; after providing the insulating substrate, covering the electrically conductive member with a reflecting member by using electrodeposition or electrostatic coating; after covering the electrically conductive member with the reflecting member, insulating a portion of the electrically conductive member to form an insulating member; and singulating the substrate by cutting the substrate to form a plurality of singulated substrates, wherein the substrate is singulated such that, in each singulated substrate, the electrically conductive member is spaced apart from end portions of the singulated substrate.