Solid-State Devices TRIZ Cases
- Micro LED Transfer Alignment Using Pre-formed Marks
Pre-formed alignment marks on the substrate guide precise micro LED unit placement, reducing fabrication time and improving transfer accuracy.
- Semiconductor Pad and Electrode Layout for Thermal Stress Management
Separating pads from connection electrodes in the thickness direction prevents insulating layer damage caused by thermal stress at high voltages.
- Memory Structure Spacer Conductive Layer Contact Process Window
A memory structure uses a spacer conductive layer with merged and non-merged portions to connect contacts.
- Memory Cell Array Current Delivery and Spike Mitigation
Spatially varying resistive materials on conductive lines mitigate current spikes near sources while maintaining delivery to distant cells.
- Back-Illuminated Image Sensor Opaque Isolation Structure
An opaque layer blocks unwanted light in peripheral regions of a back-illuminated image sensor, reducing optical cross-talk and noise generation.
- 3D Vertical NAND String Fabrication via Sacrificial Etching
Sacrificial layer etching creates vertical channels for high-density storage, resolving the trade-off between density and manufacturing complexity.