Multi-Element LED Interconnect Layout for Individual Control
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Solution Overview
Problem
Existing light-emitting devices face complexity in controlling multiple light-emitting elements without increasing the interconnect structure complexity of the substrate.
Innovation Solution
A light-emitting device configuration with a substrate and n+1 interconnects, where n light-emitting elements are mounted, allowing for individual control of light-emitting elements using a simplified interconnect structure, with specific bonding members aligned orthogonally to facilitate series connections and reduce the planar size or increase the light emission area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple light-emitting elements are mounted on the substrate, then the light emission capability is improved, but the interconnect structure complexity increases
Solution Approach 1:
Multiple interconnects are merged into a single linear sequence (first, second, third interconnects) that can control multiple light-emitting elements through shared bonding members. The first bonding member serves as a common connection point for both light-emitting elements, reducing the total number of independent interconnect paths needed.
Solution Approach 2:
The first bonding member performs multiple functions by being bonded to both the first light-emitting element and the second light-emitting element. It serves as a shared electrical connection point that enables individual control of each element while reducing the overall interconnect complexity.
2Ease of operation
If bonding members are positioned at different locations in each light-emitting element, then individual control is achieved, but the planar size increases
Solution Approach 1:
The bonding members are positioned at specific standardized locations (first bonding member at one end, second bonding member at the other end) of each light-emitting element. This localized positioning allows individual control through the interconnect sequence while maintaining compact arrangement and reducing overall planar size.
Solution Approach 2:
The interconnects are arranged in a linear sequence along the first direction, transforming the control structure from a two-dimensional matrix to a one-dimensional sequence. This dimensional reduction allows multiple elements to be controlled with fewer interconnects and smaller planar footprint.
Data Source
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AI summary
A light-emitting device includes: a substrate; n light-emitting elements (n being a natural number of 2 or more) mounted on the substrate, each comprising a first bonding member electrically connected to a first semiconductor layer, and a second bonding member electrically connected to a second semiconductor layer; and n+1 interconnects provided on the substrate, the n+1 interconnects comprising a first interconnect comprising a first external connection portion, a second interconnect comprising a second external connection portion, and a third interconnect comprising a third external connection portion. In a top-view, the first light-emitting element is located between a first side of the substrate and a second light-emitting element, and the second light-emitting element is located between a first light-emitting element and a second side.