LED Display Interconnection Layout for High-Density Bonding Yield
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Solution Overview
Problem
The increasing demand for higher resolution in LED-based displays leads to a significant challenge in handling and bonding a large number of LEDs, resulting in low yield rates due to complex alignment and interconnection requirements.
Innovation Solution
A display device design incorporating a circuit board with a redistribution layer, including conductive posts and a common conductive strip, allows for efficient interconnection and independent control of LEDs, enabling easier alignment and bonding without the need for multiple circuit board designs for different LED arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If more LEDs are used to achieve higher resolution, then the pixel density is improved, but the yield rate of handling the LEDs deteriorates
Solution Approach 1:
The circuit board design with standardized first pads arranged in a grid pattern and a surrounding second pad creates a universal interface that can accommodate different numbers and arrangements of LEDs. The redistribution layer with conductive posts and common conductive strips provides a flexible interconnection system that adapts to various LED configurations without requiring different circuit board designs, thereby maintaining high yield rates while achieving higher pixel density.
Solution Approach 2:
The circuit board is segmented into multiple first pads that can be independently connected to different LEDs through the redistribution layer. This segmentation allows each LED to be individually addressed and controlled, enabling higher pixel density while simplifying the handling process through modular connection patterns that improve yield rate.
2Manufacturing precision
If more LEDs are used to achieve higher resolution, then the pixel density is improved, but the complexity of alignment and interconnection increases
Solution Approach 1:
The standardized circuit board design with a grid arrangement of first pads and a surrounding second pad creates a universal interface that simplifies alignment regardless of the number of LEDs. The redistribution layer provides automated interconnection pathways through conductive posts and common conductive strips, reducing alignment complexity while enabling higher pixel density.
Solution Approach 2:
Multiple first pads are merged into a unified interconnection system through the redistribution layer, where conductive posts connect multiple pads to common conductive strips. This merging simplifies the interconnection complexity by providing standardized connection patterns that scale with pixel density without proportionally increasing alignment difficulty.
3Productivity
If a flexible interconnection system is implemented, then the yield rate of bonding process is improved, but the device structure becomes more complex
Solution Approach 1:
The redistribution layer with conductive posts and common conductive strips creates a universal interconnection structure that handles multiple LEDs through standardized patterns. This universal design improves bonding yield rate by providing consistent connection interfaces while managing structural complexity through systematic arrangement of conductive elements.
Solution Approach 2:
The interconnection system utilizes the vertical dimension by routing conductive posts through an insulating layer to connect first pads to control conductive plates and common conductive strips. This three-dimensional arrangement accommodates complex interconnections while maintaining a compact planar footprint, improving yield rate without proportionally increasing surface complexity.
Data Source
AI summary
A display device includes LEDs, a circuit board, an insulating layer, conductive posts, a control conductive plate, and a common conductive strip. The circuit board includes first pads and a second pad surrounding the first pads. The LEDs are on an insulating layer covering the first pads, each including a first and second electrode pad. The conductive posts are on and connected to a first portion of the first pads, and penetrate the insulation layer. The control conductive plate is electrically connected to one of the first electrode pads and the conductive posts. The common conductive strip is on the insulation layer and electrically connected to the second pad and a second electrode pad. Each first electrode pad is electrically connected to the first pads. A second portion of the first pads is completely covered by the insulation layer and overlapped with the common conductive strip and the insulation layer.