Chip-Type LED Lamp Bead Packaging for Independent Multi-Color Emission
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Solution Overview
Problem
Current chip-type LED lamp beads can only be molded in a single color, limiting their ability to emit multiple colors, and the packaging material is not suitable for debugging when multiple colors are required.
Innovation Solution
A production method for chip-type lamp beads that involves die bonding, wire bonding, molding with epoxy resin and phosphors, cutting, light splitting, and braiding to integrate multiple LED chips in parallel, allowing each chip to emit different colors and enabling the creation of polychromatic light effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple LED chips are packaged independently, then each chip can emit different colors, but the gold wires used for welding will be exposed outside the packaging material making them vulnerable to damage
Solution Approach 1:
The patent divides the packaging process into segments: first packaging some LED chips with packaging material, then packaging other LED chips with the same packaging material in a sequential manner. This segmentation allows different chips to be packaged independently with different phosphors for different colors, while still providing protection for the gold wires through the packaging material.
Solution Approach 2:
The patent performs preliminary packaging actions by first packaging certain LED chips with packaging material before completing the packaging of all chips. This preliminary packaging protects the gold wires of initially packaged chips, and subsequent packaging materials continue to protect previously exposed wires while enabling further color diversity.
2Ease of manufacture
If a unified packaging method is used for multiple LED chips, then the packaging process is simplified, but all chips must be covered by the same packaging material which limits color variety
Solution Approach 1:
The patent introduces dynamic flexibility into the packaging process by allowing different packaging materials to be applied to different LED chips based on their required emission colors. The process adapts to different color requirements while maintaining a systematic packaging approach, transforming a static unified packaging method into a dynamic multi-color capable process.
Solution Approach 2:
The patent applies different packaging materials with different phosphors to different local areas (individual LED chips) based on their specific color requirements. Each chip receives packaging material tailored to its emission needs, enabling local customization of color properties while maintaining overall process efficiency.
3Stability of the object's composition
If the same packaging material is used for all LED chips, then material consistency is maintained, but the LED lamp bead can only emit light of one color
Solution Approach 1:
The patent uses composite packaging materials that incorporate different phosphors into the same base packaging material system. Each packaging material contains specific phosphor compositions tailored to produce different colors, while maintaining the fundamental structural and protective properties of the packaging material itself. This allows color variety without compromising material consistency and reliability.
Solution Approach 2:
The patent changes the phosphor composition parameter of the packaging material to achieve different colors while maintaining other material parameters such as protective properties, adhesion, and structural integrity. By varying only the color-producing phosphor content while keeping the base material consistent, the patent achieves color diversity without sacrificing material stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the production of LED lamp beads that can emit multiple colors, expanding their application range, reducing material costs and production complexity, and improving the reliability and efficiency of lighting systems.
Implementation Method 1
a flowing direction of the packaging glue used in package cannot flow to electrode plates on both sides of a LED lamp bead bracket, but can only flow in a direction vertical to the electrode plates on both sides
Implementation Method 2
the upper mold and the lower mold are pressed and heated to melt the glue compound to form a glue mixture
Implementation Method 3
different light colors are achieved through matching with different phosphors
Data Source
AI summary
A production method for a chip-type lamp bead capable of emitting polychromatic light relates to the technical field of LED lamp beads, including steps: a first process: die bonding, for fixing a chip to a supporting plate; a second process: wire bonding, for linking positive and negative electrodes of the chip to a bracket; a third process: molding, for packaging the material with an epoxy resin after prior two steps, and different light colors are achieved through matching with different phosphors; a fourth process: cutting, for cutting the molded material into single materials; a fifth process: light splitting, for splitting light in the material having been cut; and a sixth process: braiding, packaging and shipping. Multiple LED chips can be integrated inside a chip-type lamp bead, each chip can emit light independently and control different colors, and thus the same lamp bead can achieve free mixing of multiple colors.