LED Lamp Heat Pipe Elevator for Thermal Management

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Solution Overview

Problem

Conventional LED bulbs with omnidirectional emission patterns are complex, expensive, and unreliable, and existing designs fail to optimize heat dissipation, limiting their practicality for wide-scale illumination applications.

Innovation Solution

The development of solid state lamps with thermally conductive elevating elements, such as heat pipes, that mount LEDs above the lamp base, combined with diffusers and heat sinks to manage heat and achieve desired emission patterns, including omnidirectional emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If conventional LED bulbs are designed with omnidirectional emission patterns, then light distribution is improved, but device complexity and cost increase significantly

Engineering Contradiction:
Improveomnidirectional emission patternVSAvoidstructural complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The lamp is divided into distinct functional segments: an elevated LED light source module mounted on heat pipes, a separate diffuser component, and a heat sink base. This segmentation allows each component to be optimized independently for its specific function while working together to achieve omnidirectional emission without excessive complexity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The LED light source is elevated vertically above the lamp base using thermally conductive heat pipes, creating a three-dimensional spatial arrangement. This vertical dimensionality allows light to emit in multiple directions (upward, downward, sideways) naturally, achieving omnidirectional emission patterns without complex optical components

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If heat dissipation is not optimized in LED bulbs, then manufacturing is simpler, but LED lifespan and performance are limited

Engineering Contradiction:
ImproveLED lifespanVSAvoidheat dissipation structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The heat pipes serve multiple functions simultaneously: they act as thermal conduction paths to transfer heat from LEDs to the heat sink, provide structural support to elevate the LED light source above the base, and contribute to the overall mechanical framework of the lamp. This multi-functionality reduces the need for separate components

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Heat pipes are introduced as intermediary thermal management components between the LED light sources and the heat sink base. These heat pipes efficiently conduct heat away from the LEDs while allowing the LEDs to be positioned optimally for light emission, protecting the LEDs from excessive heat without adding complex active cooling systems

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If drive current is increased to boost luminous flux, then light output is improved, but heat generation increases and reduces LED lifespan

Engineering Contradiction:
Improveluminous fluxVSAvoidheat generation
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent converts the harmful effect of heat generation into a manageable parameter by implementing an efficient passive heat dissipation system using heat pipes and heat sinks. This allows the system to operate at higher drive currents for increased luminous flux output, as the heat is continuously and efficiently transferred away from the LEDs to the surrounding environment

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient heat dissipation, increased drive current, and longer LED lifespan, allowing for higher luminous flux and compliance with energy efficiency standards like ENERGY STAR, while reducing complexity and cost, making them suitable replacements for incandescent and fluorescent bulbs.

Implementation Method 1

An elongated elevating element is mounted to the lamp with the light source mounted to the elevating element such that the solid state light source is above the lamp base. The elevating element can be made of a material that is at least partially heat conductive.

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

The elevating element can be made of a material that is at least partially heat conductive

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

A diffuser is included to diffuse light emitting from lamp into the desired emission pattern

Methodology Applied
Scientific EffectLight scattering: Scattering

Data Source

PatentUS9234655B2Lamp with remote LED light source and heat dissipating elements
Publication Date: 2016.01.12 PROSPERINA VENTURES LLC
  • US9234655B2 patent drawing
  • US9234655B2 patent drawing
  • US9234655B2 patent drawing

AI summary

LED based lamps and bulbs are disclosed that comprise an elevating element to arrange LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements.