LED Light-Emitting Layer Patterning Without Side Etching
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Solution Overview
Problem
The manufacturing process of light-emitting diodes (LEDs) faces challenges in yield and quality due to side etching during the formation of the light-emitting layer, particularly when attempting to create smaller-sized layers, making it difficult to control and maintain the process effectively.
Innovation Solution
A manufacturing method involving a patterned insulating layer with insulating openings is used, where the light-emitting layer is formed within these openings, covering a portion of the semiconductor layer, and a second semiconductor layer is deposited on top, improving yield and quality by controlling the formation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the light-emitting layer is formed by etching the light-emitting material layer to define its range, then the light-emitting layer can be created with specific dimensions, but the manufacturing yield decreases due to side etching and process control difficulties
Solution Approach 1:
The patent applies preliminary action by forming the insulating layer with insulating openings before forming the light-emitting layer. The insulating openings serve as pre-defined templates that guide the subsequent formation of the light-emitting layer, eliminating the need for etching and preventing side etching issues. This preliminary structuring enables precise dimensional control while maintaining high manufacturing yield.
2Length of moving object
If the light-emitting layer size is reduced to create smaller LEDs, then the device size and power consumption are reduced, but the process becomes increasingly difficult to control
Solution Approach 1:
The patent introduces an insulating layer as an intermediary element that facilitates the formation of small-sized light-emitting layers. The insulating openings in this layer serve as templates that define the dimensions of the light-emitting layer, enabling precise control even at reduced sizes. This intermediary structure simplifies the manufacturing process for small LEDs by providing a clear boundary definition mechanism.
3Manufacturing precision
If conventional etching processes are used to form the light-emitting layer, then the layer can be defined with specific boundaries, but side etching occurs that reduces manufacturing yield
Solution Approach 1:
The patent extracts the harmful etching process from the manufacturing sequence and replaces it with a deposition-based approach. Instead of removing material through etching to define the light-emitting layer boundaries, the method uses insulating openings as templates to guide the deposition of light-emitting material. This extraction eliminates side etching completely while maintaining precise boundary definition.
Data Source
AI summary
A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.