LED Lead Frame Tilted Surfaces Light Efficiency
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Solution Overview
Problem
Current light emitting diodes (LEDs) face inefficiencies in converting blue light into white light, resulting in lower light output and higher costs, particularly in backlight units for LCD devices.
Innovation Solution
The design incorporates a light emitting chip with a lead frame featuring tilted surfaces and a mold frame with reflection surfaces to enhance light emission and prevent moisture intrusion, along with optical sheets to scatter and converge light, improving light efficiency by 10% or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If blue light is transmitted through fluorescent material to convert into white light, then white light is generated, but light efficiency is reduced
Solution Approach 1:
The patent segments the light conversion process by using separate red, green, and blue fluorescent materials instead of a single white fluorescent material. This segmentation allows each fluorescent material to convert blue light to its specific color wavelength more efficiently, reducing energy loss in the conversion process and improving overall light output efficiency by 10% or more
Solution Approach 2:
The patent applies local quality by positioning different fluorescent materials (red, green, blue) at specific locations around the blue light emitting chip. Each fluorescent material is placed in its optimal position to receive blue light and convert it to the desired wavelength, maximizing the conversion efficiency at each local region while maintaining high overall light efficiency
2Productivity
If tilted surfaces and reflection surfaces are added to enhance light emission, then light efficiency improves, but device complexity increases
Solution Approach 1:
The patent merges the lead frame structure with the reflection function by forming tilted surfaces on the lead frame itself, which serve dual purposes of electrical connection and light reflection. The mold frame is also designed to integrate multiple functions including structural support, moisture protection, and light reflection through its molded-in reflection surfaces, thereby improving light efficiency without proportionally increasing device complexity
Solution Approach 2:
The patent utilizes the three-dimensional space around the blue light emitting chip by forming tilted surfaces at specific angles (45 degrees) on the lead frame and mold frame. This dimensional approach allows light to be reflected and directed along different paths, maximizing light extraction and emission efficiency without requiring additional flat surfaces or complex optical components
3Productivity
If lead frame with tilted surfaces is used to improve light emission, then light efficiency increases, but manufacturing difficulty increases
Solution Approach 1:
The patent incorporates the tilted surfaces and reflection surfaces into the lead frame and mold frame during the initial molding and fabrication processes. By pre-forming these light-efficient structures into the base components, the patent eliminates the need for subsequent complex machining or assembly steps, thereby maintaining manufacturing ease while achieving improved light efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved light emitting diode structure increases light output and reduces costs by enhancing light efficiency and heat radiation characteristics, while protecting against external moisture, making it suitable for use in backlight units and LCD devices.
Implementation Method 1
a first lead frame loaded with the light emitting chip and configured to include first through fourth tilted surfaces which expand outwardly from a region loaded with the light emitting diode
Implementation Method 2
a mold frame configured to encompass the first and second lead frames and to include first and second reflection surfaces
Implementation Method 3
optical sheets configured to scatter and converge light emitted from the light emitting diode
Data Source
AI summary
A light emitting diode adapted to improve light efficiency is disclosed. The light emitting diode includes: a light emitting chip; a first lead frame loaded with the light emitting chip and configured to include first through fourth tilted surfaces which expand outwardly from a region loaded with the light emitting diode, the first and second tilted surfaces being arranged symmetrically with each other in a first direction and the third and fourth tilted surfaces being symmetrical with each other in a second direction perpendicular to the first direction; a second lead frame separated by a fixed distance from the first lead frame; first and second wires configured to connect the first and second lead frames to the light emitting chip, respectively; and a mold frame configured to encompass the first and second lead frames and to include first and second reflection surfaces, which are arranged symmetrically with each other in the first direction of the first lead frame, and third and fourth reflection surfaces which are arranged symmetrically with each other in the second direction of the first lead frame.