LED Package Lens Dot Structures for Light Uniformity

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Solution Overview

Problem

Conventional light emitting diode structures suffer from non-uniform light distribution due to the limited emitting angle of the diode chip, which is not effectively enhanced by the existing package lens designs.

Innovation Solution

A light emitting diode structure featuring a package lens with integrally formed or attached dot structures, such as circles, rectangles, or polygons, which can be embossed and have varying distribution densities to modify the emitting angle and uniformity of light, achieved through methods like coating, spraying, or screen printing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a conventional package lens is used to cover the diode chip, then the light emitting structure is simple, but the light distribution remains non-uniform and the emitting angle is limited

Engineering Contradiction:
Improvelight uniformityVSAvoidpackage lens structure
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The package lens surface is segmented into multiple dot structures (protrusions or recesses) instead of a smooth surface. These dots are arranged in specific patterns to divide and redirect light paths, transforming the single uniform light source into multiple scattered light beams that achieve more uniform illumination distribution.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the package lens surface are given different local structures (dots with varying sizes, shapes, and densities). The dot distribution density can be higher near the center and lower at edges, or vice versa, depending on the desired light distribution pattern. This local variation in structure quality enables precise control over light scattering in different areas.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If the package lens surface is made larger than the diode chip, then more light can be collected, but the light becomes more non-uniformly distributed due to the limited emitting angle

Engineering Contradiction:
Improvelight collectionVSAvoidlight distribution uniformity
Core Design Contradiction:
Quantity of substanceVSIllumination intensity

Solution Approach 1:

The solution moves from a two-dimensional planar lens surface to a three-dimensional structured surface with protrusions or recesses. These dimensional features create additional light interaction paths through refraction and reflection, scattering light in multiple directions to achieve uniform distribution across the larger lens surface area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The dot structures on the lens surface act as intermediary elements between the diode chip and the final light output. These intermediate structures receive the limited-angle light from the chip and redistribute it through multiple scattering events, mediating the transition from non-uniform to uniform light distribution.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dot structures on the package lens significantly increase the emitting angle and enhance light uniformity by refracting and scattering light, resulting in a more uniform and directed light output from the diode chip.

Implementation Method 1

The dot structures on the package lens significantly increase the emitting angle and enhance light uniformity by refracting and scattering light

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 2

The dot structures on the package lens significantly increase the emitting angle and enhance light uniformity by refracting and scattering light

Methodology Applied
Scientific EffectScattering: Scattering

Data Source

PatentUS7956375B2Light emitting diode structure having a textured package lens
Publication Date: 2011.06.07 AU OPTRONICS CORP
  • US7956375B2 patent drawing
  • US7956375B2 patent drawing
  • US7956375B2 patent drawing

AI summary

A light emitting diode structure and a light emitting diode structure forming method are provided. The light emitting diode structure includes a base, a diode chip, and a package lens. The diode chip is mounted on the base. The package lens covers the diode chip. The surface of the package lens includes a plurality of dot structures. The steps of the method include mounting a light-emitting diode chip on a base, assembling a package lens to cover the light emitting diodes chip, and forming a plurality of dot structures on the surface of the package lens.