Composite Semiconductor Light Blocking Layer for LED Noise Reduction
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Solution Overview
Problem
Conventional composite semiconductor devices with LED arrays and driver circuits suffer from light emission in unwanted directions, causing interference with electrostatic latent images due to reflection from bonding wires and other objects.
Innovation Solution
A composite semiconductor device is designed with a light blocking layer between the light emitting elements and connection pads to prevent light from being reflected by surrounding objects, incorporating a semiconductor thin film, driver circuits, and a substrate with a light blocking layer that extends adjacent to the light emitting elements to block light in unwanted directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If LED arrays and driver circuits are integrated on a semiconductor substrate to increase array density, then productivity and integration are improved, but light emission in unwanted directions increases causing interference with electrostatic latent images
Solution Approach 1:
A light blocking layer is introduced as an intermediary element between the LED arrays and the electrostatic latent image formation area. This layer selectively blocks light in unwanted directions while allowing light to pass through in the desired direction, thus preventing light interference with the electrostatic latent image while maintaining the integrated high-density LED array structure
Solution Approach 2:
The light blocking layer is applied locally in specific areas where light interference occurs, rather than uniformly across the entire device. This localized approach blocks light only in the directions that cause interference while preserving light emission in the intended direction, thus resolving the contradiction between high integration density and light interference prevention
2Ease of manufacture
If bonding wires are used to electrically connect composite semiconductors to the circuit board, then ease of manufacture is improved, but light reflection from bonding wires disturbs the electrostatic latent image
Solution Approach 1:
The light blocking layer serves as a mediator that intercepts light before it can reach the bonding wires and be reflected. By positioning this layer between the light source and the reflective bonding wires, the patent prevents the formation of reflected light that would otherwise disturb the electrostatic latent image, while the bonding wires remain in place for electrical connection purposes
3Object-affected harmful factors
If the light blocking layer is positioned close to the light emitting elements to effectively block light, then light interference is reduced, but the structural complexity increases
Solution Approach 1:
The light blocking layer is integrated into the existing semiconductor substrate structure, serving multiple functions simultaneously: it blocks light in unwanted directions, maintains the electrical connection structure, and supports the overall device architecture. This multi-functional integration reduces the need for additional separate components, thereby limiting the increase in structural complexity while effectively reducing light interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The light blocking layer effectively prevents light from being reflected by connection wires or other reflective structures, reducing noise and improving light emitting efficiency by ensuring light is emitted only in the intended direction.
Implementation Method 1
The light blocking layer prevents light emitted from the light emitting element from reaching wires connected to the connection pad
Implementation Method 2
An LED type exposing unit incorporates a plurality of LED array chips, each of which includes a plurality of light emitting diodes (LEDs)
Data Source
AI summary
A composite semiconductor device includes a semiconductor thin film, a substrate, connection pads, and a light blocking layer. The semiconductor thin film includes light emitting elements. The driver circuits are formed on the substrate and the semiconductor thin film is fixed on the substrate, the driver circuit driving the light emitting element. The connection pads are formed on the substrate, electrical connection being made through which the connection pads. The light blocking layer is formed in an area between the light emitting element and the connection pad, the light blocking layer. The light blocking layer prevents light emitted from the light emitting element from reaching wires connected to the connection pad.