Light Extracting Structure on LED Current Spreading Layer
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Solution Overview
Problem
The formation of a light extracting structure on the current spreading layer in light emitting diodes (LEDs) is challenging and can damage the current spreading layer, affecting light efficiency and emission.
Innovation Solution
A light emitting device structure that includes a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a current spreading layer, a bonding layer, and a light extracting structure, with a conductive via to electrically connect the current spreading layer to the light extracting structure, and a manufacturing method involving the formation of a complex structure with a sacrificial separation layer and etching processes to expose electrode layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a light extracting structure is formed on the current spreading layer, then light extraction efficiency is improved, but the current spreading layer is damaged
Solution Approach 1:
A bonding layer is introduced as an intermediary between the current spreading layer and the light extracting structure. This bonding layer serves as a protective mediator that enables the formation of the light extracting structure without directly contacting and damaging the current spreading layer, thus resolving the contradiction between improving light extraction and maintaining layer integrity
Solution Approach 2:
The device structure is segmented into distinct functional layers: the current spreading layer, the bonding layer, and the light extracting structure. This segmentation allows each layer to perform its specific function independently, with the bonding layer specifically designed to protect the current spreading layer while enabling light extraction functionality
2Loss of energy
If a light extracting structure is formed on the current spreading layer, then light extraction capability is enhanced, but the formation process becomes difficult
Solution Approach 1:
The bonding layer is formed preliminarily on the current spreading layer before the light extracting structure is created. This preliminary action prepares a suitable surface that facilitates the subsequent formation of the light extracting structure, making the manufacturing process easier and more controllable
Solution Approach 2:
The bonding layer acts as an intermediary that simplifies the manufacturing process by providing a stable base for forming the light extracting structure, reducing the complexity and difficulty of direct formation on the current spreading layer
Data Source
AI summary
A light emitting device according to the embodiment includes a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, a current spreading layer on the second conductive semiconductor layer, a bonding layer on the current spreading layer, and a light extracting structure on the bonding layer.


