Metal Sheet Packaging for LED Electrode Formation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current LED packaging methods are inefficient in forming electrodes for two-terminal devices, particularly when dealing with large numbers of devices on a wafer, as they often require complex cutting processes and may not optimize electrical connections or light emission efficiency.
Innovation Solution
A method involving patterning a metal sheet with openings to match the distances between contacts of two-terminal devices, bonding the sheet to the devices, and cutting it to form electrodes, allowing for efficient electrical connection and potential parallel or series configurations, thereby simplifying the packaging process and enhancing light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional substrate cavity methods are used for LED packaging, then individual LED devices can be formed, but the process requires complex cutting operations and multiple fabrication steps
Solution Approach 1:
The metal sheet is segmented into multiple individual packaging structures through cutting operations. Each segmented portion forms a complete packaging unit with its own electrode connections, allowing the sheet to be divided into functional units after bonding to the LED array, thereby simplifying the overall manufacturing process.
Solution Approach 2:
The metal sheet is bonded to the LED array before cutting operations. This preliminary bonding establishes electrical connections and structural support in advance, allowing subsequent cutting to simply separate pre-formed packaging units rather than requiring complex fabrication steps for each individual device.
2Productivity
If metal sheet packaging is used for high-density LED arrays, then electrical connections and light extraction are improved, but the metal sheet requires precise patterning with multiple openings
Solution Approach 1:
The metal sheet serves multiple functions simultaneously: it provides electrical connections through conductive regions, creates packaging structures through cut portions, and enables light extraction through openings. This multi-functionality allows a single patterning process to achieve multiple objectives, reducing the need for separate precision operations.
Solution Approach 2:
The metal sheet pattern parameters (opening sizes, positions, and shapes) are optimized to correspond to the LED array geometry. By adjusting these parameters to match the device layout, the patterning process achieves high-density packaging without requiring excessive precision, as the pattern simply needs to align with the predetermined LED positions.
3Reliability
If the metal sheet is cut around each device to form electrodes, then electrical connections are optimized, but additional cutting operations are required after bonding
Solution Approach 1:
The electrode formation and device packaging operations are merged into a single cutting process. The same cutting operations that separate individual packaging units also create the electrode connections, combining two functions into one step and reducing the total number of processing operations required.
Solution Approach 2:
The metal sheet is bonded to the LED array before cutting, establishing the electrical connection framework in advance. This preliminary action ensures that the cutting operations only need to separate pre-configured electrode structures rather than requiring complex electrode formation steps during or after cutting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient packaging of multiple two-terminal devices with improved electrical connections and light extraction, facilitating the creation of high-density LED arrays with enhanced performance and reduced complexity in the packaging process.
Implementation Method 1
the metal sheet forms a first electrode to the first contact and a second electrode to the second contact
Implementation Method 2
a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device
Data Source
AI summary
A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.