LED Support Elements With Mixing Chambers for Uniform Emission
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Solution Overview
Problem
Conventional LED packages face challenges in producing high-quality light with desired emission characteristics, particularly as they are miniaturized, leading to issues with near-field and far-field emission patterns and color uniformity in displays.
Innovation Solution
The use of support elements with optical structures that include interior mixing chambers bounded by light-diffusing or light-reflective layers to increase internal reflections and path lengths of light, allowing for improved emission directionality without increasing device thickness, suitable for low-profile LED devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If LED packages are miniaturized to reduce device size, then device dimensions are reduced, but emission quality and color uniformity deteriorate
Solution Approach 1:
The patent introduces an interior mixing chamber that extends the optical path length within a compact footprint by utilizing multiple internal reflections between light-diffusing layers. This effectively adds dimensional complexity to the light propagation path without increasing the overall device volume, allowing miniaturization while maintaining emission quality.
Solution Approach 2:
The patent employs light-diffusing layers as intermediary elements within the support structure. These layers act as mediators that scatter and redirect light multiple times through the mixing chamber, ensuring uniform emission characteristics are achieved even in miniaturized packages where direct light paths would otherwise be insufficient.
2Length of stationary object
If device thickness is reduced for low-profile applications, then device height is reduced, but light path length and emission uniformity worsen
Solution Approach 1:
The mixing chamber utilizes multiple internal reflections between upper and lower light-diffusing layers to extend the effective light path length. By bouncing light between these layers, the optical path is extended in the vertical dimension without increasing overall device thickness, maintaining emission uniformity in low-profile configurations.
Solution Approach 2:
The light-diffusing layers create curved or non-linear light paths through multiple reflections and scattering events. This curved propagation path increases the effective path length within the confined thickness, allowing sufficient light mixing and uniformity to be achieved without increasing device height.
3Illumination intensity
If light path length is increased to improve emission uniformity, then device complexity increases, but device thickness increases
Solution Approach 1:
The support element is segmented into distinct functional layers: an interior mixing chamber bounded by upper and lower light-diffusing layers. This segmentation allows the light path to be extended through controlled reflections between discrete layers rather than requiring a single thick medium, achieving uniform emission without proportionally increasing overall thickness.
Solution Approach 2:
The light-diffusing layers are implemented as thin film structures that provide extensive light scattering and reflection functionality within minimal thickness. These thin films create multiple internal reflections that extend the optical path length while adding minimal dimensional bulk to the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances near-field and far-field emission uniformity and reduces the 'screen door' effect in displays by spreading and mixing light effectively, maintaining a low profile while improving light quality and color consistency across wider viewing angles.
Implementation Method 1
light-diffusing layers, such as light-diffusing particles or textured surfaces
Implementation Method 2
light-reflective layers
Implementation Method 3
support element is configured to be light-transmissive to wavelengths of light generated by the one or more LED chips
Data Source
AI summary
Light-emitting devices including solid-state light-emitting devices, light-emitting diode (LED) devices, and LED packages with support elements for improved near-field and far-field emissions are disclosed. LED chips may be mounted to support elements in a manner that directs light through the support elements in desired emission directions. Support elements include optical structures that spread and mix light laterally within the support element. Optical structures include interior mixing chambers bounded by light-altering layers, such as light-diffusing layers or light-reflective layers, that effectively increase internal reflections within the mixing chambers for lateral spreading of light. Support elements as described may be well suited for low profile LED devices where device heights are less than or equal to device widths.