LED Display Module Packaging for Black Performance and Flatness

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Solution Overview

Problem

Existing LED display modules face issues with silver-gray appearance when turned off due to solder paste overflow and uneven surface flatness caused by improper fixation of LED chips, affecting black performance and display quality.

Innovation Solution

A display module design featuring a substrate with light-emitting units comprising at least one LED chip, a lower light-transmitting layer, a black optical layer, an upper light-transmitting layer, and a transparent protective layer, which improves air-tightness and protects the LED chips while enhancing light transmission and display performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If LED chips are directly soldered onto PCB boards using traditional packaging technique, then the manufacturing process is simple, but solder paste may overflow from the solder pads causing the display screen to appear silver-gray when turned off, affecting black performance

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidblack performance

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a black matrix layer as an intermediary component between the solder pads and the display screen. This black matrix layer absorbs or blocks the reflected light from solder paste, preventing the silver-gray appearance and improving black performance while allowing the traditional soldering process to continue

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies a black-colored optical layer (black matrix) that changes the visual appearance of the underlying solder paste by absorbing light. This color-based solution transforms the harmful silver-gray reflection into a desirable black appearance, resolving the display quality issue without modifying the manufacturing process

Inventive Principle:

Principle #32Color changes

2Device complexity

If LED chips are soldered onto PCB boards, then the structure is simple, but improper fixation may lead to chip tilt, resulting in uneven surface flatness, which impacts the uniformity and brightness of the display

Engineering Contradiction:

Improvestructural complexityVSAvoidsurface flatness

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent introduces a planarization layer (thin film structure) that covers the soldered LED chips and PCB surface. This flexible thin film compensates for surface irregularities and chip tilt, providing a uniform flat surface for the display while maintaining the simplicity of the underlying structure

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The planarization layer acts as a cushioning element that anticipates and compensates for potential chip tilt and surface unevenness before they affect display quality. By pre-establishing this compensatory layer, the system ensures uniform surface flatness without requiring extremely precise chip placement

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If a packaging layer with thickness greater than the light-emitting unit is used to cover each LED chip, then air-tightness is improved and LED chips are protected, but the overall thickness of the display module increases

Engineering Contradiction:

Improveair-tightnessVSAvoiddisplay module thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent integrates the packaging layer with other functional layers (such as the black matrix layer and planarization layer) to create a nested multi-layer structure. This nesting approach allows the packaging function to be combined with other necessary layers, providing air-tightness and protection while minimizing the overall thickness increase

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution enhances the visual consistency and display quality of LED display modules by improving black performance, reducing light leakage, and ensuring uniform brightness, while also simplifying the manufacturing process and reducing costs.

Implementation Method 1

the packaging layer is configured to transmit light emitted by the LED chip

Methodology Applied

Scientific EffectLight transmission: Light

Data Source

PatentUS20250089415A1Display module, LED optical device and manufacturing method therefor

Publication Date: 2025.03.13 SHENZHEN JUFEI OPTOELECTRONICS CO LTD

AI summary

The invention discloses a display module comprising a black optical layer and a transparent protective layer. The black optical layer covers the light-emitting units and ensures proper alignment and sealing. Light-emitting units penetrate the optical layers to maintain uninterrupted light output. The packaging structure reduces moisture intrusion and protects against environmental damage. A transparent protective layer overlays the black optical layer, enhancing durability and structural integrity. Additionally, the module incorporates an anti-glare film press-fitted onto the packaging layer, minimizing external light interference and optimizing light distribution across viewing angles. These design features enable a thinner display with consistent optical performance.