LED Module Conductive Bump Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED modules face challenges in maintaining reliability and performance due to inefficient heat dissipation, often resulting in heat-related deterioration and aesthetic issues from adhesive resin usage.
Innovation Solution
The LED module incorporates a support with a heat dissipation pad and a conductive bump between the pad and the LED device's wiring, enhancing heat dissipation through surface mount technology and minimizing adhesive resin residue, while ensuring uniform spacing and improved design accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive resin is used to attach the LED device to the heat dissipation pad, then the LED device can be fixed in place, but adhesive resin may protrude and cause aesthetic issues and reliability problems
Solution Approach 1:
The patent removes the adhesive resin from the attachment process by using a conductive bump structure that mechanically and thermally connects the LED device to the heat dissipation pad without requiring any adhesive material, thereby eliminating the source of protrusion problems
Solution Approach 2:
The conductive bump acts as an intermediary element between the LED device and the heat dissipation pad, providing both mechanical support and thermal conduction functions that previously required adhesive resin, while having a controlled shape that prevents protrusion
2Reliability
If conventional mounting methods are used, then the LED device can be attached to the support, but heat dissipation efficiency is insufficient leading to reliability issues
Solution Approach 1:
The patent combines the electrical connection function and the heat dissipation function into a single conductive bump structure, eliminating the need for separate adhesive layers and simplifying the overall mounting structure while improving thermal contact
Solution Approach 2:
The conductive bump serves multiple functions simultaneously: it provides mechanical attachment, electrical connection, and thermal conduction between the LED device and the heat dissipation pad, replacing multiple separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency, prevents adhesive resin protrusion, and maintains consistent LED module characteristics, enhancing reliability and aesthetics by using a conductive bump and heat dissipation pad with high thermal conductivity materials.
Implementation Method 1
a conductive bump between the heat dissipation pad and the lower wiring
Implementation Method 2
a bonding wire electrically connecting the at least one pair of contact pads and the at least one pair of contact structures to each other
Data Source
AI summary
A LED module includes a support including a heat dissipation pad; a circuit board on the support and including contact pads and an electrical connection terminal electrically connected to the contact pads; an LED device including a wiring board having lower and upper surfaces, a lower wiring on the lower surface and facing the heat dissipation pad, an upper wiring on the upper surface and electrically insulated from the lower wiring, contact structures at one side of the upper wiring, an LED chip mounted on another side of the upper wiring, a wavelength conversion film on the LED chip, and a reflective structure covering the upper surface such that a portion of the contact structures and the wavelength conversion film is exposed; a bonding wire electrically connecting the contact pads and the contact structures; and a conductive bump between the heat dissipation pad and the lower wiring.