LED Module Lead Thin Extension Case Holding
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Solution Overview
Problem
Conventional LED modules face challenges in size reduction due to potential separation of leads from the case caused by heat generation and stress, especially in densely packed electronic devices, where the small contact area between the lead and the case is inadequate for secure mounting.
Innovation Solution
The LED module design incorporates thin extensions on the leads with corresponding holding portions in the case, which cover the top and bottom surfaces of these extensions, preventing separation by providing a larger contact area and enhanced structural integrity, allowing for size reduction while maintaining secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the LED module size is reduced to meet miniaturization demands, then the contact area between the lead and the case becomes small, but this causes the lead to be unduly separated from the case due to heat generation and stress
Solution Approach 1:
The lead is extended in the thickness direction (vertical dimension) to form a thin extension, transforming the attachment from a single-plane contact to a multi-dimensional structure. This allows the lead to protrude both above and below the case surface, creating multiple contact points and increasing attachment reliability without increasing the horizontal footprint of the LED module.
Solution Approach 2:
The lead structure is segmented into multiple portions: the main lead body and the thin extension portion. This segmentation allows the thin extension to specifically engage with the case's holding portion, distributing mechanical stress and thermal expansion forces across different segments, thereby preventing undue separation while maintaining compact overall dimensions.
2Reliability
If the contact area between the lead and the case is increased to prevent separation, then the lead attachment stability is improved, but the LED module size cannot be reduced
Solution Approach 1:
The thin extension of the lead is nested within the holding portion of the case, with the extension fitting into a dedicated recess or cavity in the case structure. This nesting arrangement maximizes the contact area between lead and case by allowing the extension to be surrounded or engulfed by the holding portion, creating a secure mechanical interlock without increasing the external dimensions of the LED module.
Solution Approach 2:
The attachment structure utilizes the thickness direction (vertical dimension) to increase contact area. The thin extension protrudes in the thickness direction and engages with the holding portion, creating a three-dimensional attachment rather than a two-dimensional surface contact. This allows sufficient attachment stability while maintaining a compact horizontal footprint.
Data Source
AI summary
An LED module is provided with a lead, an LED chip mounted on the obverse surface of the lead, and a case covering at least a part of the lead. The case has a side wall surrounding the LED chip. The lead includes a thin extension whose bottom surface is spaced apart upward from the reverse surface of the lead in the thickness direction of the lead. The case is provided with a holding portion that covers at least a part of each of the top surface and the bottom surface of the first thin extension.