LED Module Thermal Management via Segmented Pads and Metal Ribbons
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Solution Overview
Problem
Current light-emitting devices using LEDs face challenges in heat dissipation, despite advancements, as existing techniques do not adequately address the need for improved thermal management.
Innovation Solution
A light-emitting device configuration that includes a mounting board with electrically independent anode, cathode, and heat radiating pads, connected via metal ribbons to a heat sink, enhancing heat dissipation through multiple pathways, including the interconnect pattern and heat radiating pads, while using metal ribbons with high thermal conductivity for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a through interconnect is used to connect semiconductor element to heat sink, then heat dissipation is improved, but further improvement in heat dissipation is still required
Solution Approach 1:
The mounting board is divided into multiple electrically independent pads (anode pad, cathode pad, heat radiating pad) that are spatially segmented. This segmentation allows independent thermal and electrical pathways, enabling the heat radiating pad to specifically handle thermal dissipation while anode and cathode pads handle electrical connections, thereby improving overall heat dissipation capability without compromising electrical functionality.
Solution Approach 2:
The mounting board serves multiple functions simultaneously: it provides electrical connection (anode pad, cathode pad) and thermal management (heat radiating pad). By integrating both electrical and thermal functions into a single multi-functional component, the system achieves improved heat dissipation while maintaining electrical connectivity, resolving the contradiction between heat dissipation performance and functional completeness.
2Temperature
If metal ribbons with high thermal conductivity are used, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The mounting board merges the functions of electrical connection and thermal radiation into a single integrated structure with multiple pads. This consolidation reduces the need for separate components for electrical and thermal management, thereby limiting the increase in device complexity despite using high thermal conductivity materials and multiple connection pathways.
Solution Approach 2:
The mounting board is designed as a multi-functional component that simultaneously provides electrical connection and thermal management. This universal design approach allows the system to achieve high heat transfer efficiency through metal ribbons and heat radiating pads while avoiding the need for additional separate components, thus limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high heat dissipation by increasing the thermal conductivity and cross-sectional area for heat transfer, improving the efficiency of heat removal from the light-emitting elements, thereby enhancing the performance and reliability of the light-emitting module.
Implementation Method 1
The metal ribbon connects the heat radiating pad and the heat sink... using metal ribbons with high thermal conductivity for efficient heat transfer
Data Source
AI summary
A light-emitting module 1 includes a light-emitting element, a mounting board, a module board, an anode connection member, a cathode connection member, and a metal ribbon. The light-emitting element includes an anode electrode and a cathode electrode. The mounting board includes an anode pad, a cathode pad and a heat radiating pads, each of which is electrically independent. The anode electrode and the anode pad are connected. The cathode electrode and the cathode pad are connected. The module board includes an anode terminal, a cathode terminal and a heat sink. The anode connection member connects the anode pad and the anode terminal. The cathode connection member connects the cathode pad and the cathode terminal. The metal ribbon connects the heat radiating pads and the heat sink.