Light Emitting Module Pad Redistribution Circuit
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Solution Overview
Problem
The challenge in electronic devices, such as light emitting modules and devices, is the risk of short circuits and difficulty in bonding due to uneven pad distribution on the circuit structure, which affects the display quality and bonding quality with the driving substrate.
Innovation Solution
The implementation of a redistribution circuit layer that reconfigures or integrates pads on the second side of the circuit structure, reducing the number of pads and improving their dispersion, thereby reducing the risk of short circuits and enhancing bonding quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple pads are disposed on the circuit structure for connecting light emitting units, then the electrical connection is established, but the risk of short circuit increases and bonding difficulty increases due to uneven pad distribution
Solution Approach 1:
The circuit structure is divided into a first circuit layer and a second circuit layer, with pads segmented across different layers. The first pads on the first circuit layer connect to light emitting units, while the second pads on the second circuit layer provide external connections, separating functions to reduce short circuit risk.
Solution Approach 2:
The pad arrangement transitions from a single-plane distribution to a multi-layer three-dimensional structure. By distributing pads across the first and second circuit layers in the vertical dimension, the invention achieves more uniform spatial distribution and reduces bonding difficulty.
2Ease of manufacture
If multiple pads are disposed on the circuit structure for connecting light emitting units, then the electrical connection is established, but the bonding difficulty with driving substrate increases due to uneven pad distribution
Solution Approach 1:
The bonding interface is segmented into two separate layers with distinct pad arrangements. The first circuit layer handles internal light emitting unit connections, while the second circuit layer provides standardized bonding pads for the driving substrate, simplifying the bonding process and improving quality.
Solution Approach 2:
The first circuit layer acts as an intermediary between the light emitting units and the second circuit layer. It redistributes electrical connections from multiple first pads to fewer second pads, enabling simplified bonding while maintaining all necessary electrical connections.
3Reliability
If the number of pads on the second side is reduced through redistribution, then the risk of short circuit is reduced, but the circuit structure complexity increases
Solution Approach 1:
The circuit structure utilizes a multi-layer configuration where the first and second circuit layers are stacked vertically. This three-dimensional arrangement allows multiple first pads to connect to fewer second pads through vertical interconnections, reducing the pad count on the bonding surface while maintaining connectivity.
Solution Approach 2:
Multiple first pads from the first circuit layer are merged and connected to a smaller number of second pads on the second circuit layer. This consolidation reduces the number of pads requiring external bonding while preserving all necessary electrical connections through the layered structure.
Data Source
Figure 1A
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Figure 1C
AI summary
A light emitting module and a light emitting device including the light emitting module are provided. The light emitting module includes a circuit structure and a plurality of light emitting units. The circuit structure has a first side and a second side opposite to the first side. The circuit structure includes a plurality of first pads disposed on the first side and at least one second pad disposed on the second side. The first pads are electrically connected to the at least one second pad. The light emitting units are electrically connected to the first pads. The number of the first pads is more than the number of the at least one second pad.