Light Emitting Module With Patterned Conductive Layer
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Solution Overview
Problem
Conventional LED light source modules face challenges in heat dissipation efficiency due to insulation layers on circuit boards, which hinder heat transfer from LEDs to heat sinks, leading to reduced luminance and service life, and lack of flexibility in circuit connections.
Innovation Solution
A light emitting module with a patterned reflective element and conductive layer that allows for series, parallel, or series-parallel connections of LEDs, enhancing heat dissipation through a heat dissipation unit and patterned circuit layer, increasing the heat dissipation area and application flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit board with insulation layer is used to mount LEDs and connect circuits, then electrical insulation between circuit layers is achieved, but heat dissipation efficiency is reduced because the insulation layer is a poor conductor of heat
Solution Approach 1:
The patent removes the circuit board and insulation layer from the heat dissipation path between LEDs and heat sink. By directly mounting LEDs on the heat sink without an intervening circuit board, the thermal resistance introduced by insulation layers is eliminated, allowing heat to conduct directly from LED junctions to the heat sink.
Solution Approach 2:
The patent combines the electrical connection function and heat dissipation function into a single integrated structure. The conductive adhesive layer serves dual purposes: providing electrical connection between LEDs and circuit traces while simultaneously conducting heat from LEDs to the heat sink, eliminating the need for separate insulation layers.
2Ease of manufacture
If circuit layout on circuit board is completed with fixed serial-parallel connections, then electrical connections are established, but flexibility in modifying connections is lost
Solution Approach 1:
The patent enables dynamic reconfiguration of LED connections by allowing the conductive adhesive layer to be applied in different patterns after LED mounting. The connection topology (series, parallel, or series-parallel) can be changed by simply modifying the conductive adhesive application pattern, providing flexibility without requiring circuit board redesign.
3Ease of manufacture
If conventional LED mounting on circuit board is used, then LEDs are positioned and connected, but heat accumulates in LEDs reducing luminance and service life
Solution Approach 1:
The patent introduces a dual-function conductive adhesive layer as an intermediary between LEDs and the heat sink. This conductive adhesive not only provides electrical connection but also serves as a thermal conduction path, efficiently transferring heat from LED junctions to the heat sink and preventing heat accumulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents circuit breakage and improves heat dissipation efficiency, maintaining LED luminance and extending service life while simplifying the assembly process and reducing production costs.
Implementation Method 1
Heat produced by the light emitting devices is transferred to the heat dissipation unit through the patterned conductive layer and the patterned circuit layer
Implementation Method 2
the heat dissipation unit includes a ceramic substrate or a heat sink
Data Source
AI summary
A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.