LED Module Printing Method for Heat Dissipation and Transparency
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Solution Overview
Problem
Current methods for making LED modules, particularly those using thin-film technology (TFT) and printed circuit boards (PCB), are costly and complex, limiting the development of new technologies and hindering the commercialization of micro-LED technology due to high base costs and complicated processes, as well as challenges with heat dissipation and transparency.
Innovation Solution
A method involving the printing of conductive elements and islands on a flexible, light-transmissive substrate made of polyimide (PI), Polyethylene Naphtholate (PEN), or PET, with nickel, tin, or copper plating, and the use of insulation films to ensure electrical connectivity and transparency, allowing for the mounting of LED chips and enabling efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thin-film technology (TFT) or printed circuit board method (PCB) is used to make LED modules, then the manufacturing precision and electrical connectivity are improved, but the base cost increases and the process complexity increases
Solution Approach 1:
The patent replaces traditional mechanical PCB fabrication processes with a printing-based approach. Conductive elements are deposited directly onto the substrate using printing techniques, eliminating the need for complex PCB drilling, plating, and assembly processes. This substitution maintains electrical connectivity while dramatically simplifying the manufacturing process and reducing costs.
Solution Approach 2:
The patent changes the fundamental manufacturing parameter from subtractive/mechanical PCB fabrication to additive printing deposition. By controlling the printing parameters (ink composition, deposition rate, drying conditions), the method achieves precise electrical connectivity without requiring complex multi-step PCB processes, thereby reducing overall process complexity.
2Reliability
If traditional PCB methods are used, then electrical connectivity is ensured, but heat dissipation becomes problematic and transparency is reduced
Solution Approach 1:
The patent uses thin film structures for both the conductive elements and insulation layers. These thin films provide adequate electrical connectivity while maintaining excellent thermal conduction to the substrate. The flexible, thin nature of the printed layers allows heat to dissipate efficiently through the substrate, solving the heat dissipation problem inherent in traditional thick PCB structures.
Solution Approach 2:
The patent employs composite material systems where conductive inks are formulated with specific thermal conductivity properties, and insulation films are selected for their thermal management characteristics. This composite approach ensures both electrical connectivity and effective heat dissipation, while the transparency of these materials maintains visual clarity.
3Reliability
If opaque conductive materials are used on PCB, then electrical connectivity is improved, but transparency is reduced
Solution Approach 1:
The patent changes the physical parameters of the conductive material by using transparent or translucent conductive inks instead of traditional opaque PCB traces. These specialized inks maintain sufficient electrical conductivity for LED operation while allowing light to pass through, thus preserving the transparency required for display applications.
Solution Approach 2:
The patent applies different optical properties to different parts of the conductive system. The conductive elements are made transparent or translucent to maintain overall device transparency, while the insulation films are made opaque to ensure proper electrical isolation. This local differentiation of material properties solves both the connectivity and transparency requirements simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production of LED modules, maintains transparency for user visibility, and enhances heat dissipation, making the process more economical and efficient while allowing for flexible and high-resolution LED displays.
Implementation Method 1
printing a first conductive element and conductive islands on a substrate, the first conductive element being electrically connected to at least one of the conductive islands
Implementation Method 2
printing an insulation film on top of portions of the first conductive element; printing a patterned second conductive element on the substrate and on top of the insulation film
Data Source
AI summary
An LED module includes a substrate, a first conductive element formed on a top face of the substrate, wherein the first conductive element has a feature to bear at least 0.3 Amps of electrical current passing therethrough and conductive islands formed on a top face of substrate and one of which is electrically connected to the first conductive element. An insulation film is formed on a top face of the first conductive element and at least one patterned second conductive element is formed on the substrate to be electrically connected to the remainder of the conductive islands and crosses over the first conductive element at portions of the first conductive element having the insulation film formed thereon. An LED chip is mounted on the top face of the substrate to electrically connect to the first conductive element, the conductive islands and the patterned second conductive element.