Vehicular LED Module Resin Sealing for Wire Reliability
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Solution Overview
Problem
Existing light emitting modules for vehicular lamps face reliability issues due to contact failures from vibrations and corrosion in elastic contact systems and mechanical weaknesses in wire bonding, which hinder their application in vehicles.
Innovation Solution
A light emitting module using a metal wire for power supply, sealed by a first resin with lower viscosity and elastic modulus, surrounded by a second resin with higher viscosity and elastic modulus, enhancing mechanical strength and preventing corrosion, while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elastic contact between conductive land and conductive brush is used for power supply, then electrical connection is established, but contact failure occurs due to vibrations and impacts from vehicle driving
Solution Approach 1:
A resin sealing member is introduced as an intermediary substance to enclose and protect the metal wire from external vibrations and impacts. The resin acts as a buffer that absorbs mechanical stress while maintaining the electrical connection between the light emitting device and the light source pedestal, preventing contact failure under vehicle driving conditions.
Solution Approach 2:
The patent changes the physical state of the wiring from an exposed metal wire to a resin-enclosed structure. By altering the protective parameter (adding resin encapsulation), the system maintains electrical conductivity while gaining resistance to vibrations and impacts, thus improving reliability under harmful environmental factors.
2Reliability
If conductive brush size is increased to improve conductivity reliability, then electrical connection is improved, but the light emitting module size must be enlarged
Solution Approach 1:
The resin sealing member serves as a mediator that allows the use of thin metal wire for electrical connection while providing the necessary mechanical protection. This eliminates the need to increase conductive brush size, maintaining compact module dimensions while ensuring reliable conductivity through the protected wire structure.
3Volume of moving object
If metal wire with thin diameter is used for wire bonding, then space occupation is minimized and module miniaturization is achieved, but mechanical strength is insufficient and wire deformation occurs under external vibrations or impacts
Solution Approach 1:
The resin sealing member acts as a flexible protective shell that encloses the thin metal wire. This shell provides mechanical strength and resistance to vibrations and impacts while allowing the wire to maintain its thin diameter for miniaturization. The resin coating protects the wire without significantly increasing its volume.
Solution Approach 2:
The resin sealing member provides beforehand cushioning by pre-enclosing the metal wire before it is subjected to external vibrations or impacts. This preventive protection absorbs and distributes mechanical stress, preventing wire deformation and bonding breakage while maintaining the wire's compact dimensions.
4Reliability
If metal wire is exposed to external air, then electrical connection is maintained, but humidity or moisture attaches to the wire and generates rust, deteriorating durability
Solution Approach 1:
The resin sealing member creates an inert, moisture-free environment around the metal wire by encapsulating it completely. This protective barrier prevents humidity and moisture from the external air from reaching the wire surface, eliminating the conditions necessary for rust formation while maintaining the wire's electrical connection function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the mechanical strength and durability of the metal wire, preventing contact failures and corrosion, thus enhancing the reliability and miniaturization of the light emitting module for vehicular applications.
Implementation Method 1
a first resin 4 that seals the metal wire 3 and a second resin 5 that surrounds at least a portion of an outer circumference of the first resin 4
Data Source
AI summary
Provided is a light emitting module in which an LED device is mounted and power is supplied to the LED device by a gold wire. The light emitting module includes a first resin (sealing material) that seals the gold wire and a second resin (dam wall) that surrounds at least a portion of the outer peripheral of the first resin. The first resin has a lower viscosity and a lower elastic modulus compared to the second resin, and protects the gold wire mechanically and chemically. The second resin suppresses the first resin from being flowed out toward the peripherals, and, as a result, the sealing state of the gold wire by the first resin may be maintained.