LED Display Module Resin Wiring Layout for Fragile Glass Substrates
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Solution Overview
Problem
The challenge lies in manufacturing LED displays using a glass substrate, where routing wiring to the back surface is unestablished and the glass substrate is prone to breaking, making it difficult to tile and costly due to increased PCB substrate layers and wiring accuracy.
Innovation Solution
A display module manufacturing method involving forming a resin layer with light-emitting elements and first wiring on a glass substrate, then joining a printed circuit board with second wiring to the resin layer, either before or after peeling the glass substrate, to reduce substrate layers and costs while avoiding glass breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a glass substrate is used instead of a PCB substrate, then the cost of the substrate is reduced, but the glass substrate is more prone to breaking when physical force is applied
Solution Approach 1:
The patent introduces a resin layer as an intermediary between the glass substrate and the light-emitting elements. This resin layer absorbs mechanical stress and protects the fragile glass substrate from direct physical contact and damage, while still allowing the glass substrate to serve as a cost-effective base layer.
Solution Approach 2:
The glass substrate is prepared and positioned in advance as the base layer, and the resin layer is applied beforehand to provide protection. This preliminary preparation allows the fragile glass substrate to be handled and assembled without direct exposure to damaging forces during subsequent manufacturing steps.
2Manufacturing precision
If wiring is routed to the back surface of the glass substrate, then wiring accuracy can be improved, but the manufacturing process becomes more complex and difficult to establish
Solution Approach 1:
Instead of routing wiring to the back surface of the glass substrate as initially considered, the patent inverts the approach by forming the resin layer with integrated wiring structures on the front surface side. This allows wiring to be established in the more accessible resin layer rather than attempting to route through or to the back of the glass substrate.
Solution Approach 2:
The resin layer serves as a flexible medium that can accommodate wiring structures more easily than rigid glass. The resin's plasticity allows for simpler wiring formation processes compared to the rigid glass substrate, reducing manufacturing complexity while maintaining wiring accuracy.
3Manufacturing precision
If more layers are added to the PCB substrate to improve wiring accuracy, then the wiring accuracy increases, but the cost of the PCB substrate increases significantly
Solution Approach 1:
The patent segments the substrate system into two distinct functional layers: a glass substrate that provides structural support and cost-effectiveness, and a resin layer that handles the wiring functions. This segmentation allows each layer to be optimized independently, avoiding the need for expensive multi-layer PCB structures.
Solution Approach 2:
The resin layer effectively copies or replaces the wiring functionality that would otherwise require complex multi-layer PCB structures. By forming wiring directly in the resin layer, the patent eliminates the need for expensive high-layer-count PCB substrates while maintaining the required wiring accuracy.
Data Source
AI summary
The present technology relates to a display module manufacturing method and a display module that enable more suitable manufacturing of an LED display.The display module manufacturing method according to the present technology includes: forming, on a glass substrate, a resin layer in which a plurality of light-emitting elements arranged in an array and first wiring for driving the light-emitting elements are formed; and joining, before or after peeling the glass substrate from the resin layer, a printed circuit board, on which second wiring for driving the light-emitting elements is formed, to a surface of the resin layer opposite to a light extraction surface. The present technology can be applied to, for example, a large direct-view LED display that displays video content.