LED Module Shared Wiring Reduces Bonding Pads
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Solution Overview
Problem
The existing manufacturing processes for LED modules are time-consuming and costly, particularly in creating display panels with LED modules that require complex wiring and multiple subpixels, which complicates the production of high-resolution displays like UHD TVs.
Innovation Solution
A semiconductor LED module design where multiple light emitting diodes are integrated into a single chip with a matrix arrangement, utilizing a p×q matrix structure with shared wiring connections and a patterned semiconductor crystalline growth substrate, allowing for efficient electrical connections and simplified manufacturing by reducing the number of required bonding pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple separate LED modules are used to form display pixels, then each subpixel can be independently controlled, but the manufacturing process becomes time-consuming and complex due to multiple bonding pads and wiring requirements
Solution Approach 1:
The patent combines multiple LED modules (first and second light emitting diodes with different colors) into a single pixel structure, where they share common wiring (first and second wirings) and bonding pads. This merging reduces the total number of bonding pads from four (if completely separate) to two (first and second bonding pads shared by both LEDs), simplifying the manufacturing process while maintaining independent color control through the shared wiring structure.
2Ease of manufacture
If traditional separate LED module assembly is used, then each module can be manufactured independently, but the overall manufacturing time and cost increase due to complex assembly processes
Solution Approach 1:
The patent segments the pixel into distinct first and second light emitting diodes with different colors (e.g., red and green, or blue and yellow), allowing each LED type to be manufactured using optimized processes for that specific color. However, they are then integrated to share common wirings and bonding pads, achieving a balance between independent manufacturing flexibility and assembly efficiency, reducing overall manufacturing time and cost.
3Reliability
If more bonding pads are used for each LED, then electrical connections can be more direct and reliable, but the chip area increases and manufacturing becomes more complex
Solution Approach 1:
The patent makes the first and second wirings universal by having them serve multiple functions: the first wiring connects to both the first and second LEDs, and the second wiring connects to both LEDs as well. The first and second bonding pads also serve as universal connection points for both LED types. This multi-functionality reduces the total number of bonding pads and wiring required, decreasing chip area while maintaining reliable electrical connections through the shared infrastructure.
Data Source
AI summary
In some examples, a semiconductor device may comprise a semiconductor chip including a plurality of pixels, each pixel formed of a plurality of sub-pixels, such as a red sub-pixel, green sub-pixel and blue sub-pixel. Each sub-pixel may comprise a light emitting diode. A first signal line may connect to signal terminals of a first group sub-pixels (e.g., arranged in the same row), and a second signal line may connect to common terminals of a second group of sub-pixels (e.g., arranged in the same column). The number of chip pads may thus be reduced to provide increased design flexibility in location and/or allowing an increase in chip pad size. In some examples, a light transmissive material may be formed in openings of a semiconductor growth substrate on which light emitting cells of the sub-pixels were grown. The light transmissive material of some of the sub-pixels may comprise a wavelength conversion material and/or filter. Exemplary display panels and methods of manufacturing semiconductor devices and display panels are also disclosed.